Conference Venue: Marina Bay Sands Convention Centre, Singapore

Date: March 12, 2019 | Time: 8:30 a.m. - 6:30 p.m.

Click here to download the short course flyer

Click here to the opening session presentation slides

The 3rd IEEE Electron Devices Technology and Manufacturing (EDTM) Conference is to be held at the Marina Bay Sands Convention Centre in Singapore from March 12th - 15th 2019. As a conference sponsored by the IEEE Electron Devices Society (EDS), EDTM is rapidly becoming a premier conference for the electron devices community in the Asian region and beyond. EDTM provides a unique forum for discussion of a broad range of topics including materials, processes, devices, packaging, modeling, reliability and yield.


Day 1 (March 12) of the conference features an interesting collection of tutorials and short courses given by eminent scientists and speakers from around the world on topics of technical significance and current relevance. We have 4 tutorial sessions on topics ranging from front-end CMOS process to back-end-of-line, packaging and non-volatile memory technology. These tutorials sessions are catered towards students and young engineers in the industry and are intended to give a comprehensive overview of the domain presenting a roadmap of the evolution of the technology over the past two decades.


We also have 4 short courses lined up for you that cover the latest advancements in niche application areas of interest, which include hardware security, sensors for IoT, flexible and wearable electronics as well as heterogeneous integration of different device technologies. The short courses are aimed at educating our attendees with the latest ongoing applied research in these four areas that will pave way for the successful realization of internet of everything (IoE), Industry 4.0 and an AI-driven economy.

The details of the tutorials and short courses (running in parallel) are provided above. All courses are 2-hours long and registered attendees may choose to attend any combination of tutorials and short courses that suit their interests. Do sign up early for these courses if you are interested, as we have reserved only 100 seats for each session.

  • Deadline for Early-Bird Registration: 6 January, 2019
  • Group discounts for registration are available for more than 5 pax. per company / institution.
  • To register now, visit this link - https://www.conftool.org/edtm2019/


Venue for Tutorial is MELATI Room 4011

TUT.A - Logic CMOS device scaling scenarios toward N2
Naoto Horiguchi, IMEC, Belgium
8:30 -10:30 a.m.

TUT.B - Emerging nonvolatile memory technology for
storage and computing

Daniele Ielmini, Milan Poly, Italy
11:00 a.m. - 1:00 p.m.

TUT.C - Advanced Packaging Technology for More
Moore and More-Than-Moore
Chih-Hang Tung, TSMC, Hsinchu, Taiwan
2:00 - 4:00 p.m.

TUT.D - Progress in Back-End-Of-Line: Materials,
Process and Reliability

Tam Lyn Tan, GlobalFoundries Singapore
4:30 - 6:30 p.m.

Short Courses

Venue for Short Course is MELATI Room 4111

SC.A - Heterogeneous Integration of Different Device
Eugene Fitzgerald, MIT, Cambridge, USA
8:30 - 10:30 a.m.

SC.B - Advanced Sensor Technologies for IoT Era
Rakesh Kumar, GlobalFoundries Singapore
11:00 a.m. - 1:00 p.m.

SC.C - Pushing hardware security into
silicon chips: from building blocks to secure systems
Massimo Alioto, NUS, Singapore
2:00 - 4:00 p.m.

SC.D - Fully Flexible Interactive Electronic System for
Wearable and Implantable Applications
M.M. Hussain, KAUST, Saudi Arabia
4:30 - 6:30 p.m.