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5:30 PM, Wedneday, 9 May 2018 at 3 Forbes Road, Lexington, MA 02421

From Interconnect to Innovation in the DoD

Livia M. Racz - MIT Lincoln Laboratory


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In electronics packaging, as in all areas of electronics in the 20th century, the military used to set the pace for new developments, with major investments in facilities and strategic initiatives, and engineering innovation happening in large, captive semi-monopolies. This is no longer the common model for innovation. Additionally, there is instant and widespread dissemination of technological information all over the world. The aggregate result of these shifts is that we are no longer optimally equipped to apply the best technologies to problems of national security. This talk broadly examines some of the top unmet needs, reviews some of the approaches that are being used successfully to address the challenges, and focuses on the value added by truly innovative developments in Advanced Packaging and Microsystems Integration. An innovation framework is presented, which introduces rigor into value creation by integration, which goes beyond reduction of size, weight, and power. Case studies are selected and reviewed from the literature, and example research projects are highlighted that are currently in progress at MIT Lincoln Laboratory.

   


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