5:30 PM, Wednesday, 17 May 2017 at MACOM, 121 Hale Street, Lowell, MA
Assessment of Copper Bond Wire for Use in Long Term Military Applications
Aaron Lecomte - Raytheon Integrated Defense Systems
This presentation will review findings from the destructive physical analysis (DPA) testing performed on a number of standard commercial plastic encapsulated microcircuits (PEMs). We will focus on the die ball bond and lead frame crescent bond metallurgical structures, mechanical bond strength, wire composition, and manufacturing bonding process workmanship & overall quality.
Based on the DPA findings, potential risks will be defined along with recommendations to the qualification program of PEMs with copper bond wire for use in harsh environments and long term high reliability military programs.