COMMITTEE

Steering Committee
EDS Vice President of Technical Committees & Meetings (Chair)Ravi Todi GLOBALFOUNDRIES
EDS PresidentSamar Saha Prospicient Devices
EDS Junior Past PresidentAlbert Wang Univ. of California, Riverside
EDS Senior Past PresidentPaul Yu Univ. of California, San Diego
EDS President-ElectFernando Guarrin GLOBALFOUNDRIES
EDS TreasurerSubramanian S. IyerUniv. of California, Los Angeles
General ChairShuji Ikedatei Solutions
 
Executive Committee
General ChairShuji Ikedatei Solutions
Technical Program Chair, Publication ChairHitoshi WakabayashiTokyo Tech
J-EDS Special Issue ChairMasaaki NiwaTohoku Univ.
J-EDS Special Issue Vice Chair
(J-EDS Editor-in-Chief)		Mikael OstlingKTH, Royal Inst. of Tech.
Education Chair Akira ToriumiThe Univ. of Tokyo
Education Vice ChairMansun ChanHong Kong Univ. of Sci. and Tech.
Publicity Chair Keiji IkedaToshiba
Publicity Vice Chair Tian Ling Ren Tsinghua Univ.
Emerging Technologies Chair Bin ZhaoON Semiconductor
Emerging Technologies Vice Chair Hiro AkinagaAIST
Financial ChairIriya MunetaTokyo Tech
Finacial Vice Chair
(EDS Treasurer)		Subramanian S. IyerUniv. of California, Los Angeles
International Advisory Chair
(EDS VP SRC)		M. K. RadhakrishnanNanoRel
International Advisory Vice Chair
(EDS Secretary)		Simon DeleonibusCAT-LETI
Exhibits / Sponsorship Chair Kazunari IshimaruToshiba
Exhibits / Sponsorship Vice Chair Reza ArghavaniLam Research
Support Relationship Chair Seiichiro KawamuraJST
 
Education Committee
ChairAkira ToriumiThe Univ. of Tokyo
Vice ChairMansan ChanHong Kong Univ. of Sci. and Tech.
MembersToshihide NabatameNIMS
Jiro IdaKanazawa Inst. of Tech.
Carmen LillyUniv. of Illinois
Chandan SarkarJadavpur Univ.
Daniel CamachoIntel
 
International Advisory Committee
ChairM. K. RadhakrishnanNanoRel
Vice ChairSimon DeleonibusCAT-LETI
MembersAngus RockettUniv. of Illinois
Tim AndersonUniv. of Masschusetts
Illesanmi AdesidaUniv. of Illinois
Patrick FayUniv. of Notre Dame
Juin J. LiouUniv. of Central Florida
Rajendra SinghClemson Univ.
Christofer HieroldETH Zürich
Cor ClaeysImec / KU Leuven
Ming LiuChinese Academy of Sciences
T. Y. ChiuSMIC
Steve ChungNational Chiao Tung Univ.
Kwyro LeeKAIST
Chennupati JagadishAustralian National Univ.
Firdaus AbdullahSilterra
Juzer VashiIIT Bombay
Ramgopal RaoIIT Delhi
Raj JammyCarl Zeiss
Jim PlummerStanford Univ.
Chenming HuUniv. of California, Berkeley
John HuNVIDIA
Sunit TyagiigrenEnergi, Inc
Jamal DeenMcMaster Univ.
Anisul HaqueEast West Univ.
Albert ChinNational Chiao Tung Univ.
Kaustav Banerjee Univ. of California, Santa Barbara
Sandeep BahlTexas Instruments
Monuko du PlessisUniv. of Pretoria
John SuehleNIST
Jeffrey J. WelserIBM Almaden Research Center
Min YangIBM TJ Watson Research Center
D. NirmalKarunya Univ.
Serge BiesmansTEL Europe
Eric BeyneImec
Jinho AhnHanyang Univ.
Meyya Meyyappan NASA's Ames Research Center
Leda LunardiNorth Carolina State Univ.
Xing ZhouNanyang Technological Univ., Singapore
Ru HuangPeking Univ.
Hiroshi IwaiTokyo Tech
 
Exhibits / Sponsorship Committee
ChairKazunari IshimaruToshiba
Vice ChairReza ArghavaniLam Research
Chair supportMasumi SaitohToshiba
MembersKatsumi OhmoriTokyo Ohka Kogyo Co., LTD.
Atanu KunduHeritage Inst. of Tech.
Sachin SonkusalePDF Solutions
Shima SasakiTEL
Masaya AsaiSCREEN
 
Industrial Advisory Committee
ChairKazunari IshimaruToshiba
MembersMasaki MomodomiToshiba
Yukimasa YoshidaLam Research Japan
Tadahiro SuharaSCREEN
Yoshinobu MitanoTEL
Harutoshi SatoTokyo Ohka Kogyo Co., LTD.
Satoru YamadaSamsung
Seok-Hee LeeSK Hynix
Anne CirkelMentor Graphics
Teruo HirayamaSony
Atsuyoshi KoikeSanDisk Japan
Steven JohnstonIntel
Min CaoTSMC
Hitoshi NakaoApplied Materials Japan, Inc
Ken SugimotoJSR
William ChenASE
Sachin SonkusalePDF Solutions
 
Technical Program Committee
ChairHitoshi WakabayashiTokyo Tech.
 
Sub-Committee: Devices and Manufacturing for "Cloud and Edge"
Chair Ken UchidaKeio Univ.
MembersKenji TateiwaTowerJazz Panasonic Semiconductor
Jiro IdaKanazawa Inst. of Tech.
Hidetoshi OhnumaSony
Kazuaki SawadaToyohashi Univ. of Tech.
Masumi SaitohToshiba
Takeshi YanagidaKyushu Univ.
Adrian IonescuEPFL
Ru HuangPeking Univ.
Mei-Kei IeongASTRI
Gong XiaoNational Univ. of Singapore
Kejun XiaNXP Semiconductors
Ya-Chin KingNational Tsing Hua Univ.
Osbert ChengUMC
Hangbing LvChinese Academy of Sciences
Naoto HoriguchiImec
Jong-Ho LeeSeoul National Univ.
Jae-kyu LeeSamsung
Wilman TsaiTSMC
 
Sub-Committee: Packaging and Manufacturing for "Cloud and Edge"
Chair Shintaro YamamichiIBM
MembersTakayuki OhbaTokyo Tech
Makoto MuraiSony
Hisashi KanekoJSR
Yoichiro KuritaToshiba
Katsumi KikuchiNEC
Michihiro InoueAIST
Jean TrewhellaGLOBALFOUNDRIES
Kyeong Sool SeongJ-Devices
Naoki OkaApplied Materials Japan, Inc
 
Sub-Committee: Process, Tools and Manufacturing
Chair Jiro YugamiHitachi Kokusai Electric Inc.
MembersNobuyoshi KobayashiASM
Makoto MiuraHitachi High-Technologies Corp.
Yoji KawasakiSMIT
Shuji TanakaTohoku Univ.
Kazuo NojiriLam Research
Yasushi AkasakaTEL
Sean CunnighamIntel
Xiaojun GuoShanghai Jiao Tong Univ.
Masanobu SatoSCREEN
Wenwu WangChinese Academy of Sciences
Kyoichi SuguroToshiba
Osamu NakatsukaNagoya Univ.
Yuichi SetsuharaOsaka Univ.
Byoung Hun LeeGwangju Inst. of Sci. and Tech.
Yasuhiro MorikawaULVAC
Hyosan LeeSamsung
Gill LeeApplied Materials,Inc
 
Sub-Committee: Materials
Chair Soo-Hyun KimYeungnam Univ.
MembersTakao EnomotoTKK
Toshihide NabatameNIMS
Iriya MunetaTokyo Tech
Kazuhito MatsukawaSUMCO
Toshiya SakataThe Univ. of Tokyo
Atsuhiro TsukuneTAIYO NIPPON SANSO Corp.
Satoshi FujimuraTokyo Ohka Kogyo CO., LTD
Hyungjun KimYonsei Univ.
Muhammad Mustafa HussainKing Abdullah Univ. of Sci. and Tech. (KAUST)
Paul BergerOhio State Univ.
Srabanti ChowdhuryUniv. of California, Davis
Satoshi KamoJSR
Pei-Wen LiNational Chiao Tung Univ.
 
Sub-Committee: Modeling & Reliability
Chair Mitiko Miura-MattauschHiroshima Univ.
Members Dondee NavarroHiroshima Univ.
Colin MacAndrewNXP
Durga MisraNew Jersey Inst. of Tech.
Wladyslaw GrabinskiMOS-AK
Mansun ChanHong Kong Univ. of Sci. and Tech.
Xing ZhouNTU Singapore
Zhiping YuTsinghua Univ.
Tian-Ling RenTsinghua Univ.
Natrain AroraSiprosys Inc.
Tibor GrasserTU Wien
Perumal RatnamSanDisk / Western Digital
Sadayuki YoshitomiToshiba
Lining ZhangHong Kong Univ. of Sci. and Tech.
Kenji OkadaTowerJazz Panasonic Semiconductor
Mahadeva Iyer NatarajanGLOBALFOUNDRIES
Pin SuNational Chiao Tung Univ.
Kin Leong PeySingapore Univ. of Tech. and Design　
Anthony S. OatesTSMC
Inkook JangSamsung
Hisayo Sasaki MomoseYokohama National Univ.