| 1. Devices and Manufacturing for "Cloud and Edge" |
| Masateru Taniguchi |
Osaka Univ. |
| Minoru Yoshida |
Hakusan Kogyo |
| Bill Nehrer |
PDF Solutions |
| Atanu Kundu |
Heritage Inst. of Tech. |
| |
| 2. Packaging and Manufacturing for "Cloud and Edge" |
| Akio Katsumata |
J-Devices |
| Tadahiro Kuroda |
Keio Univ. |
| Nobuhiko Nishiyama |
Tokyo Tech |
| Piyush Gupta |
Qualcomm |
| |
| 3. Process, Tools and Manufacturing |
| Sommawan Khumpuang |
AIST |
| Alek Chen |
ASML |
| Hiroshi Yanazawa |
MEMS Core |
| Wen-Kuan Yeh |
NNDL National Univ. of Kaohsiung |
| |
| 4. Materials |
| Jin Onuki |
Ibaraki Univ. |
| Kazunari Kurita |
SUMCO |
| Jean-Marc Girard |
Air Liquide |
| Rozalia Beica |
Dow Chemical |
| Mikko Matvejeff |
Picosun |
| V. Ramgopal Rao |
Indian Inst. of Tech. Delhi |
| |
| 5. Reliability & Modeling |
| Mahadeva Iyer Natarajan |
GLOBALFOUNDRIES |
| Takayuki Sekisue |
ANSYS |
| Andreas Schenk |
ETH Zurich |
| Shiban Koul |
Indian Inst. of Tech. Delhi |
| Victor Moroz |
Synopsys |
| Andreas Kerber |
GLOBALFOUNDRIES |
| Souvik Mahapatra |
Indian Inst. of Tech. Bombay |
| |
| 6. Emerging Technologies |
| Cheol Seong Hwang |
Seoul National Univ. |
| Masanao Yamaoka |
Hitachi |
| Andrew Adamatzky |
Univ. of the West of England |
| Wolfgang Tress |
EPFL |
| Robert M. Shelby |
IBM |
| |
