35th International Electronics Manufacturing Technology Conference 2012
Invited Papers
Title:Low-Temperature Sintering of Nanosilver Paste for Lead-Free Chip Attach
Speaker: Prof. Guo-Quan (GQ) Lu, Ph.D., Virginia Polytechnic Institute and State University, USA
Title:Low COO PVD solutions addressing 2.5D and 3D packaging challenges
Speaker: Patrick Desjardins, Oerlikon Systems
Title:Nanostructured Titania and Micromachined Titanium for Thermal Management in Microelectronics
Speaker: Zuruzi Abu Samah, Singapore University of Technology and Design, Singapore
Title:Through-Silicon Via Technology for Three-Dimensional Integrated Circuit Manufacturing
Speaker: Yann Civale, Imec, Belgium