Components, Packaging & Manufacturing Technology Society

Malaysia Chapter

IEEE

35th International Electronics Manufacturing Technology Conference 2012

Invited Papers

guo-quan

Title:Low-Temperature Sintering of Nanosilver Paste for Lead-Free Chip Attach

Speaker: Prof. Guo-Quan (GQ) Lu, Ph.D., Virginia Polytechnic Institute and State University, USA


patrick

Title:Low COO PVD solutions addressing 2.5D and 3D packaging challenges

Speaker: Patrick Desjardins, Oerlikon Systems


zuruzi

Title:Nanostructured Titania and Micromachined Titanium for Thermal Management in Microelectronics

Speaker: Zuruzi Abu Samah, Singapore University of Technology and Design, Singapore


yann

Title:Through-Silicon Via Technology for Three-Dimensional Integrated Circuit Manufacturing

Speaker: Yann Civale, Imec, Belgium