Components, Packaging & Manufacturing Technology Society

Malaysia Chapter

IEEE

35th International Electronics Manufacturing Technology Conference 2012

Speakers for Short Courses

richard

Title: Analog Electronics Testing and Product Engineering

Speaker: Prof. Richard Gale, Texas Tech University, USA

Duration: Full Day


lee

Title: Lead-Free Solder Joint Reliability - Material Consideration

Speaker: Dr. Ning-Cheng Lee, Indium Corporation, USA

Duration: Full Day


ming

Title: Advanced Failure Analysis

Speaker: Xue Ming, Infineon, SINGAPORE

Duration: Half Day


tseng

Title: Progressive Advances in High Density Substrates & Packaging to Deliver More than Moore

Speaker: Andy Tseng, Advanced Semiconductor Engineering, USA

Duration: Half Day