Title: Automotive Industry Packages Technology

Speaker: Jens Oetjen, Infineon Munich, Germany

Title: Production Test Challenges

Speaker: Marc Mydill, Texas Instruments, Dallas, Texas, USA

Title: Wafer Level Packaging and MEMS sensors

Speaker: Won Kyu Jeung, Central R & D Institute, Samsung Electro-Mechanics Co., KOREA

Title: ATE based System Level Test as an enabler for high volume heterogeneous 3D IC

Speaker: Gregory Smith, Teradyne, USA

Title: An efficient and flexible R&D approach for the Semicon Industry

Speaker: LW Yong, Carsem, Malaysia

Title: I-Manufacturing

Speaker: Sharon Ko, Carsem, Malaysia

Title: Embedded ICs and Passives Technology for Wireless Communication Applications

Speaker: Assoc. Prof. Sung Yi, Portland State University, USA

Title: Technology Trends and Challenges on EMS assembly and testing for next generation networking products

Speaker: Kim Hyland, Cisco Systems, USA