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Phoenix Chapter Technical Tutorial/Presentation Meetings

April 19, 2006Thermal Design and Management in ElectronicsDownload details »
Thermal design and management challenges are common across a wide range of electronic products and applications. Road mapping by leading organizations (ITRS, SIA, and NEMI) identifies thermal management as one of the key challenges to overcome for the sustained growth in electronics. Higher density, performance, reliability and lower cost demand much from the thermal management professionals in creating solutions.

The half-a-day tutorial taught by four professionals will address: Thermal Modeling and Characterization, Applications in the Computational and Wireless Communication Products, and Emerging Thermal Technologies. Non-experts and beginners in thermal discipline will be able to learn from the tutorial content. Professionals and subject experts can benefit from the teachers experiences and interactions with other participants.
August 23, 2006Board Level Reliability Issues for Lead Free Solder JointsDownload details »
Lead free solder has been in production for several years. Some market segments are fully converted to lead free, while other segments are just starting the conversion. This presentation will focus on the board level reliability issues that currently exist for lead free solder joints. Several failure modes will be discussed: creep rupture, thermal fatigue, interface failure, and electromigration. Both reliability testing and life prediction will be reviewed.
September 19, 2006Failure Analyses for Electronic PackagingDownload details »
Introduce basic methods, tools and techniques of failure analyses practiced in microelectronic packaging. Present applications in Flip Chip Interconnect, Pb-free solders, High Performance Processor Packaging, and Ceramic & Plastic Packaging. Discuss failure modes, mechanisms and resolutions in these application areas. Look beyond the limitations of current day’s tools and techniques to address the needs of next generation interconnect and package technologies.