Tutorials
Tutorial 1 (Presentation will be in Japanese)
Moderator : Akira Toriumi
- Nano Imprint
- Shinji Matsui ,Univ Hyogo
Anupam Mitra ,Toshiba - Adhesion and Bonding
- Katsuhiko Horigome ,Lintec Corp.
Takehito Shimatsu ,Tohoku Univ.
Tutorial 2 (Presentation will be in English)
- 3D Design and Process
- Moderator : Mukta G. Farooq, GLOBALFOUNDRIES
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- Design for 2.5D- and 3D -Stacked ICs
paul Franzon,North Carolina State Univ.(90 min) - Overview of Monolithic 3D IC Processing
Zvi Or-Bach,MonolithIC 3DTM Inc.(90 min)
- Design for 2.5D- and 3D -Stacked ICs
Short Courses
Short Course 1
Memory-based Technology
- Moderator: Jiro Ida
- 1. ReRAM Fundamentals
- Cheol Seong Hwang (Seoul National Univ.)
- 2. Integration of ReRAM and PCRAM
- Daniele Ielmini (Politecnico di Milano)
- 3. NVM-based Neuromorphic
- Hyunsang Hwang (Pohang Univ. of Sci. & Tech., POSTECH)
- 4. NVM-based System
- Shimeng Yu (Arizona State Univ.)
Short Course 2
Advanced FET Technology
- Moderator: Toshihide Nabatame
- 1. Advanced CMOS Technology
- Frederic Boeuf (STMicroelectronics)
- 2. Gate Stack Reliability
- Tibor Grasser (Technische Universität Wien)
- 3. Doping and Contact Technology
- Kah-Wee Ang (National Univ. of Singapore)
- 4. Characterization-based Yield Engineering
- Kazunori Nemoto (Hitachi High-Tech)
(*) Lecture titles are tentative.