Co-organizers
- 清华大学
- 北京未来芯片技术高精尖创新中心
- 电子科技大学
- 成都市集成电路行业协会
- 成都汀兰会展有限公司
- 中科芯未来
- 成都高新区集成电路业界共治理事会
- 成都国家现代服务业集成电路设计产业化基地
Platinum Sponsors
Gold Sponsors
Silver Sponsors
Bronze Sponsors
Copyright 2020-2021 EDTM.
All Rights Reserved.
SPONSORSHIP & EXHIBITION
We cordially invite you to join EDTM 2021 as Sponsors and Exhibitors to support a successful EDTM 2021, and to promote your brand name, products and services at EDTM 2021.
Feel free to contact us at:
Sponsorship & Exhibition Chairs:
He Qian, qianh@tsinghua.edu.cn
Xuecheng Zou, estxczou@hust.edu.cn
Bill Nehrer, bill.nehrer@gmail.com
Aabid Husain, aabid@atomera.com
General Chair:
Albert Wang, aw@ece.ucr.edu
Tianchun Ye, tcye@ime.ac.cn
Call for Sponsors (PDF) Chinese Version
Call for Exhibitors (PDF) Chinese Version
Application Form (XLSX) Chinese Version