The performance of integrated circuits and systems continues to grow in spite of the device miniaturization nearing the end of scaling. Thus, to facilitate systems integration, a much needed assembly or forum was crucial to initiate deep-dive discussions among technical communities on materials, processes, and devices to accelerate manufacturing innovations. Asia, by virtue of its strong manufacturing base, offers a strong potential to take an initiative for systems integration. Therefore, the IEEE Electron Devices Society (EDS) started this fully sponsored Electron Devices Technology and Manufacturing (EDTM) conference and inaugurated the 1st EDTM 2017 conference in Toyama, Japan during February 28 – March 2, 2017.

The IEEE EDS fully-sponsored 4th EDTM conference is a full three-day event to be held in Penang, Malaysia during March 16 – 18, 2020.

As semiconductor device and technology scaling challenges continue to grow, so should the increase in the industries collaborative efforts to overcome these scaling challenges. Thus, IEEE EDTM 2020 is intended to providing a timely forum for the electron devices community to come together to collaborate on topics from devices-to-materials-to-tools-to-process, modeling & simulation, manufacturing, and packaging thus, creating new and innovative technologies for systems integration, and providing a complete solution to enabling smart environments and integrated ecosystems.

EDTM 2020 Co-General Chairs

Arjun Kantimahanti
Silterra, Malaysia

Samar Saha
Prospicient Devices, USA