picture courtesy of Tourism Malaysia

EDTM2020 Virtual Conference

EDTM2020 Virtual Conference Sessions

Opening Remarks
 
Technical Sessions
Plenary Session 1-3
Plenary Session 4-5
Plenary Session 6-7
Session 1A: Focus Session 1: Thin-Film Transistor
Session 1B: Nanotechnology Materials and Manufacturing
Session 1C: Density Functional Theory-Based Simulation
Session 1D: Power and RF Devices
Session 2A: Large Area and Flexible Electronics
Session 2B: Design and Technology
Session 2C: TCAD-1
Session 2D: GaN and III-V Devices
Session 3A: Advanced Photovoltaic Devices and Detectors
Session 3B: 2.5/3D Integration
Session 3C: TCAD-2
Session 3D: GaN Power Devices
Session 4M: Focus Session 2: Reliability and DTCO
Session 4C: Novel Photodetectors
Session 4D: Materials for Novel Devices
Session 5A: Reliability 1
Session 5B: Compact Modeling
Session 5C: Sensors and Inductors
Session 5D: Materials for Manufacturing
Session 6A: Reliability 2
Session 6B: Memory Modeling and Interface Trap Modeling
Session 6C: Neural Network and NVM 1
Session 6D: SiC-Power Devices
Session 7A: Emerging Memory for IoT
Session 7B: Advanced Transistors
Session 7C: Materials Processing
Session 7D: Neural Network and NVM 2
Session 8A: 2D Materials and Devices
Session 8B: Manufacturing and Characterization
Session 8C: Variability Modeling
Session 8D: Focus Session 3: Packaging and Heterogeneous Integration
Session 9C: RF Device Modeling
Poster Presentations (P-1 to P-20)
Poster Presentations (P-21 to P-40)
Poster Presentations (P-41 to P-55 and High School Student Poster Presentations)
 
Sponsors & Exhibitors
Diamond Sponsors
Emerald Systems Sdn Bhd / Mentor, a Siemens Business
Platinum Sponsors
Synopsys
LAM RESEARCH
Gold Sponsors
Tokyo Electron Limited
Evatec AG
Applied Materials, Inc.
Silvaco Singapore Pte Ltd
Silver Sponsors
NISSIN ION EQUIPMENT Co., LTD.
Kioxia
Atomera
Bronze Sponsors
Cadence Design Systems (S) Pte Ltd
Semiconductor Fabrication Association of Malaysia
Intel Corp
UNIVERSITI SAINS MALAYSIA (USM)
Exhibitors
tei Solutions Inc.