In Cooperation with:

Visa Application

IUS 2012 Organizing Committee supports participants who need visas to visit Germany.

According to IEEE's guidelines for providing visa letters such formal letters of invitation will only be issued to:
- People the committee knows
- Speakers/Presenters
- Committee members
- Attendees/Exhibitors who have paid their registration fee in full

Obtaining Visa Application Document (Formal Letter of Invitation)

Visa requirements: Germany has updated its visa regulations, so it may take you several weeks to months to apply for and receive your visa. For details that apply specifically to your country please go immediately to your nearest German Consulate or Embassy. Review your visa status now to determine if you need a visa or visa renewal to enter Germany and to find out how to schedule an interview appointment, pay fees, and other vital instructions. If you need a personal letter of invitation to attend the 2012 IEEE International Ultrasonics Symposium, contact the Conference Coordinators by e-mail at:

Manfred Weihnacht
IFW Dresden
Phone: +49 351 4659 330
Fax:      +49 351 4659 313

Please provide the following information (order like stated below):
- salutation (Mrs. / Mr.)
- title (Prof. / Dr. / ...)
- complete name  (first, middle, last name),
- complete mailing address (company/institution, street, city, state/province, postal code, country),
- e-mail address,
- whether you are author/co-author (including ID# of your contribution),
- whether you have already registered AND paid your registration fee (incl. Invoice #),          and
- any other details that Germany or your country of residence requires for your visa application.

Please clarify, whether e-mail or faxed version or only an original copy rmay be accepted with your visa application.

The Conference cannot contact or intervene with any German Embassy or Consulate office abroad on your behalf so please begin your visa application process as soon as you determine that you want to attend the 2012 IEEE International Ultrasonics Symposium.