37th International Electronics Manufacturing Technology (IEMT) - 18th Electronics Materials & Packaging (EMAP) Conference
Call for Papers for the 37th International Electronics Manufacturing Technology (IEMT) - 18th Electronics Materials & Packaging (EMAP) Conference 2016
Date: 20 - 22 September 2016
Venue: G Hotel, George Town, Penang, Malaysia
The IEMT-EMAP 2016 will be held at Georgetown, Penang, Malaysia. It is an international event organized by the IEEE CPMT Malaysia Chapter with co-sponsorship from CPMT society of IEEE, Santa Clara Valley Chapter.
IEMT-EMAP 2016 will feature short courses, 4 parallel technical sessions, and table top exhibition. It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation. It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up-to-date knowledge in the field. Since 1990’s, IEMT has gained a reputation as a premier electronic materials and manufacturing technology conference and well attended by experts all over the world.
SCOPE OF PAPERS SOLICITED
Extended abstracts are being sought from, but not limited to, the following areas:
| Advanced Packaging (2.5D/3D & Wafer level packaging) |
| Assembly & Manufacturing Technology |
| Thermal/Mechanical/Electrical Design, Simulation & Characterization |
| Materials & Processing |
| LED, MEMS & Sensor Packaging |
| Emerging Packaging & Interconnection Technologies (Optoelectronics packaging; Medical electronics packaging; Nano technology, materials and packaging & Wearable electronics) |
| Advanced Semiconductor Fabrication Technologies (Thin film materials and processing; Frontend process characterization & Yield enhancement |
| IC Testing Technology |
| Surface Mount Technology |
| Quality, Reliability & Failure Analysis |
To download the Call for Papers documents, please click here
Full Paper submission date is 15th JUNE 2016