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CPMT NEWSLETTER for JUNE 2009

We invite you to download the full June CPMT Society NEWSLETTER, or any of the individual stories listed below. Circulate key articles and announcements to your co-workers.

Full Newsletter (1.3 MB)

INDEX to individual PDFs:
- President's Column
- Officers, Committee Chairs
- Society news, Awards, Elections
- Four Book Reviews
- Conference News: ECTC, SWTW
- Student Chapter News
- Upgrade to Senior Member
- Trans-CPT CFP: Solid-State Lighting
- Upcoming conferences/events:
- Electronic Packaging Technology Conference (EPTC 2009)
- CFP: Electrical Design of Advanced Packaging and Systems (EDAPS 2009)
- Electronic Materials and Packaging Conference (EMAP 2009)
- Int'l Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009)
- Int'l Conference on 3D System Integration (3D IC)
- Workshop on Accelerated Stress Testing & Reliability (ASTR)
- CFP: IEEE CPMT Symposium Japan
- Flexible Electronics Symposium
- CFP: ECTC Electronic Components and RF Committee
- CFP: SEMI-THERM Symposium
- Future Directions in IC and Package Design Workshop (FDIP)
- Electrical Performance of Electronic Packaging (EPEP 2009)

JUNE 2009 NEWSLETTER (continued)

UPCOMING CONFERENCES:
- August 10-13: Int'l Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China

- Sept. 14-16: 2009 IEEE Holm Conference on Electrical Contacts (Holm 2009), Vancouver, BC, Canada

- Sept. 21-22: 2009 IEEE International Conference on Portable Information Devices (PORTABLE), Anchorage, AK, USA

- Sept. 28–30: 2009 3rd International Conference on 3D System Integration (3DIC 2009), San Fancisco, CA, USA

- Oct. 7–9: Int‘l Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009), Leuven, Belgium

- Oct. 7-9: IEEE/CPMT Workshop on Accelerated Stress Test and Reliability (ASTR 2009), Jersey City, NJ, USA

- Oct. 18: Future Directions in IC and Package Design Workshop (FDIP), Portland, OR USA

- Oct. 19-21: IEEE Electrical Performance of Electronic Packaging (EPEP 2009), Portland, OR USA

- Oct. 21-23: Int'l Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2009), Taipei, Taiwan

- Dec. 1-3: 11th Electronic Material and Packaging Conference (EMAP 2009), Penang, Malaysia

- Dec. 2-4: 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009), Hong Kong, China

- Dec. 9-11: 2009 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore

- Feb. 21-25: 26th Thermal Measurement, Modeling and Management Symposium (SEMI-THERM 2010), Santa Clara, CA

- June 1-4: 60th Electronic Components and Technology Conference (ECTC 2010), Las Vegas, NV

CALLS FOR PAPERS:
- Dec. 2-4: IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009), Hong Kong, China (Due August 31)

- Feb. 21-25: 26th Thermal Measurement, Modeling and Management Symposium (SEMI-THERM 2010), Santa Clara, CA (Due August 17)

- June 1-4: 60th Electronic Components and Technology Conference (ECTC 2010), Las Vegas, NV (due October 15)

See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.

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