- August 10-13: Int'l Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China
- Sept. 14-16: 2009 IEEE Holm Conference on Electrical Contacts (Holm 2009), Vancouver, BC, Canada
- Sept. 21-22: 2009 IEEE International Conference on Portable Information Devices (PORTABLE), Anchorage, AK, USA
- Sept. 28–30: 2009 3rd International Conference on 3D System Integration (3DIC 2009), San Fancisco, CA, USA
- Oct. 7–9: Int‘l Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009), Leuven, Belgium
- Oct. 7-9: IEEE/CPMT Workshop on Accelerated Stress Test and Reliability (ASTR 2009), Jersey City, NJ, USA
- Oct. 18: Future Directions in IC and Package Design Workshop (FDIP), Portland, OR USA
- Oct. 19-21: IEEE Electrical Performance of Electronic Packaging (EPEP 2009), Portland, OR USA
- Oct. 21-23: Int'l Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2009), Taipei, Taiwan
- Dec. 1-3: 11th Electronic Material and Packaging Conference (EMAP 2009), Penang, Malaysia
- Dec. 2-4: 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009), Hong Kong, China
- Dec. 9-11: 2009 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore
- Feb. 21-25: 26th Thermal Measurement, Modeling and Management Symposium (SEMI-THERM 2010), Santa Clara, CA
- June 1-4: 60th Electronic Components and Technology Conference (ECTC 2010), Las Vegas, NV
CALLS FOR PAPERS:
- Dec. 2-4: IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009), Hong Kong, China (Due August 31)
- Feb. 21-25: 26th Thermal Measurement, Modeling and Management Symposium (SEMI-THERM 2010), Santa Clara, CA (Due August 17)
- June 1-4: 60th Electronic Components and Technology Conference (ECTC 2010), Las Vegas, NV (due October 15)
See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.
