Sponsored Workshop and Conferences
The EDMS sub-committee currently sponsors four major conferences which are:
- Electrical Performance of Electronic Packaging and Systems - EPEPS
- https://www.epeps.org
- Held once a year in USA.
- Signal Propagation on Interconnects - SPI
- https://www.spi2011.unina.it
- Held once a year in Europe.
- Electrical Design of Advanced Packaging and Systems - EDAPS
- https://www.edaps2011.org
- Held once a year in Asia.
- International Symposium of Quality Electronic Design - ISQED
- https://www.isqed.org
- Held once a year in USA.