Affiliated Universities
Faculty at the following universities have significant research programs in advanced packaging with focus on electrical design, modeling and simulation. These faculty are associated with EDMS sub-committee. Below are links to the faculty web pages:
- Andreas Cangellaris, University of Illinois, Urbana Champaign, USA (https://alpha1.ece.uiuc.edu/)
- Flavio Canavero, Politechnico University de Torino, Italy (https://www.emc.polito.it/staff/personal.asp?dir=canavero)
- John Prince, University of Arizona, USA (https://www.ece.arizona.edu/people/faculty/alphabetical/faculty.php?ID=34)
- Joungho Kim, Korea Advanced Institute of Science and Technology (KAIST), S. Korea (https://tera.kaist.ac.kr)
- Madhavan Swaminathan, Georgia Institute of Technology, USA (https://www.ece.gatech.edu/research/labs/hppdl)
- Michel Nakhla, Carleton University, Canada (https://www.doe.carleton.ca/~msn/)
- Paul Franzon, North Carolina State University, USA (https://www.ece.ncsu.edu/erl/faculty/paul_data/Mar02/index.htm)