In Cooperation with:

Technical Program Committee (TPC)

Technical Program Chair

Mauricio Pereira da Cunha
University of Maine
Orono, ME, USA

Group 1: Medical Ultrasonics

Vice Chair of TPC:

 Jan D'hooge, Ph.D.
 Catholic University of Leuven
 Leuven, Belgium
 

Members:

  1. Olivier Basset: CREATIS, Université Lyon I, France
  2. Ayache Bouakaz: INSERM, Université Tours, France
  3. Lori Bridal: Univ. Pierre and Marie Curie, France 
  4. Charles Cain: University of Michigan, USA
  5. Jean-Yves Chapelon: INSERM, France 
  6. Greg Clement: Harvard Medical School,USA 
  7. Paul Dayton: UNC Chapel Hill and NC State University, USA 
  8. Emad Ebbini: University of Minnesota, USA 
  9. Stanislav Emelianov: University of Texas at Austin, USA 
  10. David Evans: University of Leicester, UK 
  11. Kathy Ferrara: University of California Davis, USA 
  12. Stuart Foster: University of Toronto, Canada 
  13. James Greenleaf: Mayo Clinic College of Medicine, USA 
  14. Anne Hall: General Electric Medical Systems, USA 
  15. Christopher Hall: Philips Research North America, USA 
  16. Peter Hoskins: The University of Edinburgh, UK 
  17. John Hossack: University of Virginia, USA 
  18. Kullervo Hynynen: University of Toronto, Canada 
  19. Jorgen Jensen: Technical University of Denmark, Denmark 
  20. Nico de Jong: Erasmus Medical Centre and University of Twente, The Netherlands 
  21. Hiroshi Kanai: Tohoku University, Japan 
  22. Jeff Ketterling: Riverside Research Institute, USA 
  23. Michael Kolios: Ryerson University, Canada 
  24. Elisa Konofagou: Columbia University, USA
  25. Chris de Korte: Catholic Univ. of Nijmegen, The Netherlands 
  26. Nobuki Kudo: Hokkaido University, Japan 
  27. Pai-Chi Li: National Taiwan University, Taipei, Taiwan 
  28. Jian-yu Lu: University of Toledo, USA 
  29. Tom Matula: University of Washington, USA 
  30. James G. Miller: Washington University in Saint Louis, USA 
  31. Kathy Nightingale: Duke University, USA 
  32. Svetoslav Nikolov: BK Medical, Denmark 
  33. William O'Brien: University of Illinois, Urbana-Champaign, USA 
  34. Georg Schmitz: Ruhr-Universität Bochum, Germany 
  35. Ralf Seip: Philips Research North America, USA 
  36. Mickael Tanter: INSERM, France 
  37. Tom Thomas: Boston Scientific, Inc., USA 
  38. Kai Thomenius: General Electric's Corporate R&D, USA 
  39. Hans Torp: Norwegian University of Science and Technology, Norway 
  40. Piero Tortoli: Univerniversità degli Studi di Firenze, Italy 
  41. Ton van der Steen: Erasmus Medical Centre, Rotterdam, The Netherlands 
  42. Kendall Waters: Silicon Valley Medical Instruments,USA 
  43. Keith Wear: US Food and Drug Administration, USA 
  44. Wilko Wilkening: Siemens Medical Solution, USA

 

Group 2: Sensors, NDE, and Industrial Application

Vice Chair of TPC:

 Jafar Saniie, Ph.D.
 Illinois Institute of Technology
 Chicago, Illinois, U.S.A. 

Members:

  1. Robert C. Addison: Rockwell Science Center, USA 
  2. Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany 
  3. Michal Bezdek: Endress+Hauser Flowtec AG, Switzerland
  4. James Blackshire: Air Force Research Laboratory, USA
  5. Ramazan Demirli: Villanova University, USA 
  6. James Friend: Monash University, Australia 
  7. Eric S. Furgason: Purdue University, USA 
  8. David Greve: Carnegie Mellon University, USA 
  9. Edward Haeggstrom: University of Helsinki, Finland 
  10. Mitsutaka Hikita: Kogakuin University, Japan 
  11. Jacqueline Hines: Applied Sensor Research and Development Corporation, USA 
  12. Patrick Johnston: NASA Langley Research Center, USA 
  13. Fabien J. Josse: Marquette University, USA 
  14. Lawrence W. Kessler: Sonoscan Inc., USA 
  15. Pierre T. Khuri-Yakub: Stanford University, USA 
  16. Mario Kupnik: BTU Cottbus, Germany
  17. Jun-ichi Kushibiki: Tohoku University, Japan 
  18. Roman Maev: University of Windsor, Canada
  19. Kentaro Nakamura: Tokyo Institute of Technology
  20. Erdal Oruklu: Illinois Institute of Technology, USA
  21. Massimo Pappalardo: University di Roma TRE, Italy 
  22. Tony Sinclair: University of Toronto, Canada 
  23. Bernhard Tittman: Pennsylvania State University, USA 
  24. Jiromaru Tsujino: Kanagawa University, Japan 
  25. John F. Vetelino: University of Maine, USA 
  26. Paul Wilcox: University of Bristol, UK 
  27. William Wright: University College Cork, Ireland
  28. Donald E. Yuhas: Industrial Measurement Systems, Inc., USA 

 

Group 3: Physical Acoustics

Vice Chair of TPC:

 Vincent Laude
 Institut FEMTO-ST
 France 

Members:

  1. Manabu Aoyagi: Muroran Institute of Technology, Japan
  2. Art Ballato: Clemson University, Clemson SC, USA
  3. Jan Brown: JB Consulting, USA
  4. Emmanuel Defay: CEA LETI, Minatec Campus, France
  5. Christine Demore: University of Dundee, UK
  6. Jianke Du: Ningbo University, China
  7. Tao Han: Shanghai Jiaotong University, China
  8. Fred Hickernell: Retired from Motorola, USA
  9. Takefumi Kanda: Okayama University, Japan
  10. Eun Sok Kim: University of Southern California, USA
  11. Yonkee Kim: U.S. Army, USA
  12. Minoru Kuribayashi Kurosawa: Tokoy Institute of Technology, Japan
  13. Amit Lal: Cornell University, USA
  14. John Larson: Avago Technologies, USA
  15. Andreas Mayer: Hochschule Offenburg, Germany
  16. Roy H. Olsson III: Sandia National Laboratories, USA
  17. Mihir Patel: Schlumberger-Doll Research, USA
  18. Edgar Schmidhammer: TDK-EPC, Germany
  19. Susan Schneider: Marquette University, USA
  20. Bikash Sinha: Schlumberger-Doll Research, USA
  21. Joerg Wallaschek: Leibniz Universitaet Hannover, Germany
  22. Ji Wang: Ningbo University, China
  23. Tsung-Tsong Wu: National Taiwan University, Taiwan R.O.C.
  24. Yook-Kong Yong: Rutgers University, USA
  25. Jiun Der Yu: Epson Research and Development Inc., USA 
  26. Hairong Zheng: Zhenzhen Institutes of Advanced Technology, China

 

Group 4: Microacoustics - SAW, FBAR, MEMS

Vice Chair of TPC:

 Karl Wagner
 TDK-EPC
 Munich, Germany 

Members:

  1. Ben Abbott: Triquint, USA 
  2. Robert Aigner: Triquint, USA 
  3. Ivan Avramov: Institute of Solid State Physics, Bulgaria 
  4. Sylvain Ballandras: FEMTO-ST, France 
  5. Kushal Bhattacharjee: RF Micro Devices, USA 
  6. Sunil Bhave: Cornell University, USA 
  7. Sergey Biryukov: IFW Dresden, Germany 
  8. Paul Bradley: Avago, USA 
  9. Jidong Dai: RF Monolithics, USA 
  10. Omar Elmazria: Universié de Nancy--CNRS, France 
  11. Gernot Fattinger: Triquint, USA 
  12. Gerhard Fischerauer: University of Bayreuth, Germany
  13. James Friend: Monash University, Australia 
  14. Ken-ya Hashimoto: Chiba University, Japan 
  15. Shitang He: IACAS, China
  16. Chunyun Jian: Ericsson, Canada 
  17. Michio Kadota: Murata, Japan 
  18. Jyrki Kaitila: Avago, Germany 
  19. Ilia Katardjiev: Uppsala University, Sweden 
  20. Kimmo Kokkonen: Aalto University, Finland 
  21. Jan Kuypers: Sands 9, Inc., USA 
  22. Ken Lakin: Consultant, USA 
  23. Don Malocha: University of Central Florida, USA 
  24. Natalya Naumenko: Technological University Moscow, Russia
  25. Hiroyuki Odagawa: Kumamoto National College of Technology, Japan 
  26. Takeo Oita: Retired from NDK, Japan
  27. Tuomas Pensala: VTT, Finland 
  28. Mauricio Pereira da Cunha: University of Maine, USA 
  29. Maximilian Pitschi: TDK-EPC AG, Germany
  30. Viktor Plessky: GVR Trade SA, Switzerland 
  31. Leonard Reindl: Albert-Ludwigs-University Freiburg, Germany 
  32. Richard Ruby: Avago Tech, USA 
  33. Clemens Ruppel: TDK-EPC, Germany
  34. Takahiro Sato: Samsung, Japan 
  35. Marc Solal: Sawtek, USA 
  36. Masanori Ueda, TAIYO YUDEN CO., LTD, Japan
  37. Robert Weigel: Friedrich-Alexander University Erlangen-Nuremberg, Germany 
  38. Sergei Zhgoon: Moscow Power Engineering Institute, Russia 

 

Group 5: Transducers and Transducer Materials

Vice Chair of TPC:

 Paul Reynolds
 Paul Reynolds Consulting
 USA 

Members:

  1. Sandy Cochran: University of Dundee, UK
  2. Christopher Daft: Samplify Systems, USA 
  3. Loriann Davidsen: Philips Healthcare, USA
  4. Levent Degertekin: Georgia Institute of Technology, USA 
  5. Charles Emery: Mirabilis Medica, USA 
  6. John Fraser: Philips Healthcare, USA 
  7. Steven Freear: University of Leeds, UK
  8. Jean-Francois Gelly: GE Healthcare, France 
  9. Reinhard Lerch: Friedrich-Alexander-University Erlangen-Nuremberg, Germany 
  10. Geoff Lockwood: Queen's University, Canada 
  11. Richard O'Leary: University of Strathclyde, UK
  12. Omer Oralkan: Stanford University, USA 
  13. Wei Ren: Xi'an Jiaotong University, China
  14. Paul Reynolds: Paul Reynolds Consulting, USA
  15. Sorah Rhee: Ethicon Endo-Surgery, USA
  16. Yongrae Roh: Kyungpook National University, Korea 
  17. Ahmad Safari: Rutgers University, USA
  18. Jean-Francois Saillant: Areva, France
  19. Mark Schafer: Sonic Tech Inc., USA 
  20. Scott Smith: GE Global Research, USA 
  21. Stephen Smith: Duke University, USA 
  22. Wallace Smith: Office of Naval Research, USA 
  23. Yasuhito Takeuchi: Kagoshima University, Japan 
  24. Jian Yuan: Boston Scientific, USA
  25. Qiming Zhang: Pennsylvania State University, USA 
  26. Qifa Zhou: University of Southern California, USA