PROGRAM

Plenary & Invited Speakers

Plenary Speakers

Logic Technology Scaling to Continue Moore's Law
Mark Bohr Intel
 
Abstract & Biography
 
 
2D Materials for Smart Life
Kaustav Banerjee Univ. of California, Santa Barbara (UCSB)
 
Abstract & Biography
 
Evolution of The GPU Device Widely Used in AI and Massive Parallel Processing
Toru Baji nVIDIA Japan
 
Abstract & Biography
 
 

Keynote Speakers

Fan-Out Wafer-Level Packaging - A New Trajectory for Moore's Law Scaling
Rajendra D. Pendse Qualcomm
 
Heterogeneous Integration using the Silicon Interconnect Fabric
Subramanian S. Iyer UCLA
 Women in Engineering / Young Professional Event
Mukta Farooq GLOBALFOUNDRIES
Biography
 
 
Atsuyoshi Koike Western Digital / SanDisk Limited
Biography
 

Invited Speakers

1. Packaging
Yoshihisa Kagawa Sony
WonChul Do Amkor
Rolf Aschenbrenner Fraunhofer IZM
Hitoshi Kawashima AIST
 
2. Devices
Woo Young Choi Sogang Univ.
Teodor Rosca EPFL
 
3. Manufacturing/Yield
Yoshitaka Horikoshi Cadence Design Systems, Inc.
Roman Mostovoy Applied Materials
Rebecca Mih Lam Research
Mahbub Rashad Globalfoundries
Tomasz Brozek PDF Solutions
 
4. Process/Tools
Andrew Kummel Univ. of California, San Diego
Thorsten Bernd Lill Lam Research
Zengfeng Di Chinese Academy of Sciences
Gerrit Jan Leusink TEL Technology Center, America, LLC
 
5. Materials
Hitoshi Tabata The Univ. of Tokyo
Shizuo Tokito Yamagata Univ.
Hang Tong Edwin Teo Nanyang Technological Univ.
Junichi Koike Tohoku Univ.
 
6. Reliability/Modeling
Mitiko Miura-Mattausch Hiroshima Univ.
Ling Li Chinese Academy of Sciences
Mahadeva Iyer Natarajan GLOBALFOUNDRIES
 
Nanotech Featuring Session
Frank habil. Schwierz TU Ilmenau
David Esseni Univ. of Udine
Geng-Chiau Liang National Univ. of Singapore
James Teherani Columbia Univ.
Saptarshi Das Penn State Univ.