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ABOUT

IEEE EDTM 2023 - a Brief History

IEEE Electron Devices Technology and Manufacturing (IEEE EDTM) Conference was established by the IEEE Electron Devices Society (EDS) to enable further performance/functionality enhancement of semiconductor devices and systems with manufacturing innovations to overcome scaling challenges. IEEE EDTM provides the forum where device, process, material, and tool communities gather and discuss their novel ideas for technological breakthrough. IEEE EDTM rotates among Asian countries where hot-hubs of semiconductor manufacturing are located. Launched in 2017 in Toyama, Japan, IEEE EDTM was subsequently held in Kobe, Japan (2018), in Singapore (2019), in Penang, Malaysia (2020), in Chengdu, China (2021), in Oita, Japan – Full virtual (2022), and will take place first time in Seoul, Korea this year. IEEE EDTM is a premier conference, providing a unique forum for discussions on a broad range of device/manufacturing-related topics.

Mission of IEEE EDTM 2023

The 7th Electron Devices Technology and Manufacturing Conference (IEEE EDTM 2023) will be held in Seoul, the capital and largest metropolis of Korea which is home to the headquarters of global-leading local companies. IEEE EDTM 2023 is a full four-day conference to be held during March 7-10, 2023. IEEE EDTM 2023 aims to be a premier global forum for researchers and engineers from around the world coming to share new discoveries and discuss about any device/manufacturing-related topics, including but not limited to, materials, processes, devices, packaging, modeling, reliability, manufacturing and yield, tools, testing, and any emerging device technologies, as well as workforce training. The Theme for IEEE EDTM 2023 is: Strengthen the global semiconductor research collaboration beyond the COVID-19 pandemic era

Conference Overview

Date March 7-10, 2023
Location COEX, Seoul, Korea
Hosted by SK Hynix, KoNTRS
Program
  • - Opening Ceremony
  • - Plenary Talks
  • - Technical Session
  • - Tutorials / Short Courses
  • - Exhibition
  • - Rump Session
  • - Poster Session
  • - Welcome Reception
  • - Banquet
  • - Closing Ceremony
IEEE EDTM 2023 General Chair

Changrock Song, Ph.D.

EVP, Head of CIS Development
SK hynix

IEEE EDTM 2023 General Co-Chair

Byoung Hun Lee, Ph.D.

Professor/Head, Department of Semiconductor Engineering
Pohang University of Science and Technology (POSTECH)