Government Support

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Platinum Sponsors

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Exhibition

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서브상단

Program at a Glance and Program Details

Final Program

Program Book PDF Pdf
KST EEST
Athens		 CEST (CET)
Paris		 UTC EDT
New York		 PDT
Los Angeles
March. 7
(Tue.)		 TIME #307 bc #308 bc #317
Room B Room D Room F
09:00~12:30 Tutorial 1
"Technology for Advanced Semiconductor Manufacturing"		 Tutorial 2
"New Computing Paradigm: Quantum Computing"		 Tutorial 3
"Advanced Packaging Technology for Heterogeneous Integration"
12:30~14:00 Lunch  (on your own)
14:00~17:30 Short Course 1
"Advances in Manufacturing and Processing Technologies"		 Short Course 2
"CMOS Image Sensor Technology"		 Short Course 3
"Power and Energy Devices"
18:00~20:00 Welcome Reception (3F, #327) 
March. 8
(Wed.)		 TIME #301  #307 bc #307 a #308 bc #308 a #317 #318 3F, Lobby
Exhibition
09:00~18:00
Room A Room B Room C Room D Room E Room F Room G
09:00~09:15 Opening Ceremony (4F, Grand Conference #401)
09:15~10:00 [Plenary 1]  "Journey of Memory Innovation in the AI Computing Era"
by Dr. Seon Yong Cha (SK hynix) (4F, #401)
10:00~10:45 [Plenary 2]   "Semiconductor Scaling for the Next Decade Enabled by Holistic Lithography"
by Dr. Michael Lercel (ASML) (4F, #401)
10:45~10:55 Coffee Break
10:55~12:30 1A 2B 3C 4D 5E 6F 7G
Advanced Interconnect for Packaging Advanced Display Technologies Emerging Materials and Devices Physical Sensors and Resonators Advanced Manufacturing Techniques DRAM and Flash RF Device Modeling and Simulation
12:30~13:30 Lunch (on your own)
13:30~15:05 8A 9B 10C 11D 12E 13F 14G
Advanced Interposer RDL Technology Flexible Optoelectronics and Biophotonics Materials for Ferroelectric and Electronic Devices Optical and Motion Sensors Manufacturing Process Control Memory for Computing (I) Neural Network Based Modeling and Simulation
15:05~15:15 Break Time
15:15~16:50 15A 16B 17C 18D 19E 20F 21G
Advanced Fan-Out Package Detectors and Imaging Technologies I Advanced BEOL Materials and Technologies Chemical and Flexible Sensors Smart Manufacturing and Machine Learning RRAM and PCM Emerging Devices Modeling I
16:50~17:00 Coffee Break
17:00~18:35 22A 23B 24C 　 25E 26F 27G
Advanced Packaging Structure and Process Advanced Photonics Novel Computing Device Technologies 1 (Neuromorphic, Quantum, MVL Computing) Women in EDS Panel Session Processing of New Materials for Future Technologies Oxide-Channel Ferroelectric Memories High Voltage Compact Modeling
19:30~21:00 Rump Session 1 "Sustainability in Semiconductor Manufacturing" (3F, Room F (#317))
Rump Session 2 "Global Semiconductor R&D Cooperation. Is It Still Necessary or Possible to Continue in This Time of Supply Chain Crisis?" (3F, Room G (#318))
March. 9
(Thu.)		 TIME #301  #307 bc #307 a #308 bc #308 a #317 #318 3F, Lobby
Exhibition
09:00~18:00
Room A Room B Room C Room D Room E Room F Room G
09:00~09:45 [Plenary 3]  "A System Driven Approach to Semiconductor Innovation"
by Suman Datta (Georgia Institute of Technology) (3F, Auditorium)
09:45~10:30 [Plenary 4]  "Semiconductor Manufacturing Challenges toward 2030 and beyond"
by Junichi Kitano (TEL) (3F, Auditorium)
10:30~13:00 Poster Session (3F, #300) & Lunch  (on your own)
13:00~14:35 28A 29B 30C 31D 32E 33F 34G
Power Devices and Widebandgap Heterostructures (1) Fabrication and Integration Novel Computing Device Technologies 2 (Neuromorphic, Quantum, MVL Computing) Ferroelectric Technology for Logic and Memories Flexible Electronic Device Fabrication and Process Memory for Computing (II) Emerging Devices Modeling II
14:35~14:45 Coffee Break
14:45~16:20 35A 36B 37C 38D 39E 40F 41G
Power Devices and Widebandgap Heterostructures (2) Detectors and imaging technologies II IoT, Wearable & Flexible Devices Wide Bandgap Channel Devices Health Monitoring System and Therapy Ferroelectric Memories TCAD for Nano-Scale FET
16:20~16:30 Coffee Break
16:30~18:05 42A 43B 44C 45D 46E 47F 48G
Power Devices and Widebandgap Heterostructures (3) Device Reliability Nanoscale Materials Advanced CMOS Technology Energy Harvesting Device and System Memory for New Applications Modeling for Variability and Manufacturing
18:30~20:30 Banquet (Grand Inter Continental Seoul Parnas Hotel, 5F, Grand Ballroom)
March. 10
(Fri.)		 TIME #301  #307 bc #307 a #308 bc #308 a #317 #318 3F, Lobby
Exhibition
09:00~15:30
Room A Room B Room C Room D Room E Room F Room G
09:00~09:45 [Plenary 5]  "Innovation of Process Technology for Future Semiconductor"
by Jong Myeong Lee (Samsung Electronics) (3F, Auditorium)
09:45~10:30 [Plenary 6]  "Meeting Scaling Challenges through Materials Engineering"
by Mukund Srinivasan (Applied Materials) (3F, Auditorium)
10:30~10:40 Coffee Break
10:40~12:15 49A 50B 51C 52D 53E 　 　
Power Devices and Widebandgap Heterostructures (4) Application Reliability Nanoscale
Devices		 Group IV Devices Wearable and Skin Compatible Sensor
12:15~13:15 Lunch (on your own)
13:15~14:50 54A 55B 56C 57D 58E 　 　
Energy Materials and Devices System Reliability Nanoscale Fabrication Devices for Emerging Applications Wearable Display and Theoretical Study
14:50~15:00 Break
15:00~15:30 Closing & Awards Ceremony (3F, Auditorium)
IEEE EDTM 2023 Topics Session Code
1. Materials 3C, 10C, 17C
2. Process, Tools, Yield, and Manufacturing 5E, 12E, 19E, 25E
3. Semiconductor Devices 31D, 38D, 45D, 52D, 57D
4.  Memory Technologies 6F, 13F, 20F, 26F, 33F, 40F, 47F
5.  Photonics, Imaging and Display 2B, 9B, 16B, 23B, 29B, 36B
6.  Power and Energy Devices 28A, 35A, 42A, 49A, 54A
7.  Modeling and Simulation 7G, 14G, 21G, 27G, 34G, 41G, 48G
8.  Reliability 43B, 50B, 55B
9.  Packaging and Heterogeneous Integration 1A ,8A, 15A, 22A
10.  Sensor, MEMS, Bio-Electronics 4D, 11D, 18D
11.  Flexible and Wearable Electronics 32E, 39E, 46E, 53E, 58E
12.  Nanotechnologies 44C, 51C, 56C
13.  Disruptive Technologies - IoT, AI/ML, Neuromorphic & Quantum Computing 24C, 30C, 37C