Call for Papers

We cordially invite you to submit ORIGINAL 3-page Camera-Ready papers to the 2023 IEEE Electron Devices Technology and Manufacturing (IEEE EDTM 2023) Conference for possible presentations. Original papers are sought on any topic within the scope of IEEE EDTM 2023.

Topics for IEEE EDTM 2023

1. Materials

All device-related materials, including semiconductors, magnetics, ferroelectrics, insulators, metals, liquid crystals, photoresist, organic films, precursors, EUV photoresist, etching gas, filaments, and phase-changing materials. Materials engineering for reducing costs, and improving reliability/yield/manufacturability. Smart materials enabling intelligent devices are highly welcome.

2. Process, Tools, Yield, and Manufacturing

Semiconductor processes and equipment, including process modules (deposition, dry/wet etch, cleaning, planarization, isolation, dielectrics, metals, silicides, lithography), process integration, process control, equipment impact on devices, reliability and yield, self-assembly techniques, process sensing, process enhancement by AI/ML, etc.

3. Semiconductor Devices

All semiconductor devices including Si/Ge CMOS, interconnects, compound semiconductors, oxide semiconductors, low-dimensional nanomaterials (van der Waals heterostructures, nanowires, nanotubes, nanosheets, quantum dots), ferroelectric, spintronics, 3D devices, RF/THz devices, etc. Emerging device concepts for future computing are encouraged, such as tunnel FET, negative capacitance FET, topological insulators, phase transitions, Qubit devices, etc.

4. Memory Technologies

All memories, including embedded and standalone memories, volatile and nonvolatile memories, in-memory and neuromorphic computing. Topics on charge-based memories, RRAM, MRAM, PCM, FeRAM, cross-point and selectors, bio-inspired memory, scaling, processing, characterization, reliability, modeling, 3D integration, read/write/erase, novel hierarchies and architectures for memory-centric computing.

5. Photonics, Imaging and Display

Topics on photonics, photonics for energy, optoelectronics, microwave photonics, nano-photonics, optical sensors incluing emerging materials, perovskites, etc, optical communications/networking, optical switch, bio-photonics, lasers, optical systems, bio-imagng, imagers, display technology including QLEDs, OLEDs, VR, AR, and others, and other emerging technologies in photonics, imaging and display.

6. Power and Energy Devices

Device technologies related to high-voltage devices, power/RF devices, energy harvesting devices, photovoltaics, energy storage devices, discrete/integrated power devices, power modules/systems. Power device structures such as diodes, BJTs, FETs, IGBTs. Power device materials such as wide bandgap and ultra-wide bandgap materials (SiC, GaN, AlN, GaO, etc.). Power device fabrication processes, modeling and simulation.

7. Modeling and Simulation

Advanced in modeling/simulation of electron devices, packages, and processes. Numerical, analytical, and statistical modeling/simulation of electronic, optical or hybrid devices, interconnects, technology CAD, benchmarking, monolithic integration, heterogeneous integration, design-technology co-optimization (DTCO), system-technology co-optimization (STCO), parasitic elements, fabrication processes, physical phenomena, mechanical systems, electro-thermal effects, test structures, and methodologies.

8. Reliability

Advances in reliability of materials, processes, devices, modules and systems including interconnects, ESD, latch-up, soft errors, radiation, noises and mismatch behavior, hot-carrier effects, self-heating, biasing and thermal instabilities, dielectric wear-out and breakdown, , process charging damage, elctromigration, reliability test structures and methodologies, defect monitoring and control, electromagnetic robustness, and design-for-reliability. Also, topics on reliability of emerging memories, more-than-Moore application, biomedical devices, automotive, and aerospace application.

9. Packaging and Heterogeneous Integration

Advances in packaging and heterogeneous integration technologies, including 2.1D, 2.5D and 3D integrations. Topics on advanced packaging and manufacturing technologies, such as waferlevel packaging, chiplets, ultra-fine-pitch interconnection, sub-micron package-level wiring, optical/wireless interconnect, power/sensor device packaging, controlling thermal-expansion coefficient, thermal management.

10. Sensor, MEMS, Bio-Electronics

Advances in sensors and actuators including MEMS, BioMEMS/NEMS, transducers, resonators, micro/nano-fluidic devices, bio-sensors, implantable biomedical devices, biomolecular-based memories, bio-transistors, semiconductor synthetic biological devices/systems, semiconductor synaptic/neural devices, brain-inspired computing, brain-interface devices, and heterogeneous integration with CMOS.

11. Flexible and Wearable Electronics

Topics on flexible and wearable electronics including flexible and wearable transistors and related integrated circuits, sensors, RFID, light emitting diodes, lighting and display, energy harvesting and storage devices, novel and manufacturing process for flexible and wearable electronics, and materials for flexible and wearable electronics.

12. Nanotechnologies

Advances in nanotechnologies including nanomaterials, nanoelectronics, low-dimensional systems including 2D materials and devices, nanophotonics, nanofabrication, nanoenergy, nanobiomedicine, nanosensors, and related nano characterization/modelling techniques.

13. Disruptive Technologies - IoT, AI/ML, Neuromorphic & Quantum Computing

Topics on disruptive technologies

Authors should follow the detailed descriptions in the paper template to prepare their manuscripts.

Download the Paper Template (64KB)

Submitted papers will be subjected to IEEE standard review processes and publishing guidelines, as well as IEEE EDTM 2023 review criteria. The accepted and presented papers will be included in the IEEE EDTM 2023 Proceedings (Camera-Ready at submission and to be published AS IS if accepted), which will be published in IEEE Xplore. The authors of a selected high-impact papers will be invited to submit extended versions for possible publication in the Special Issue on IEEE EDTM 2023 in IEEE Journal of Electron Devices Society (J-EDS), subjected to J-EDS author guidelines, and standard IEEE review and publication policy.

Presentation formats of contributed papers are oral or poster, and authors can indicate their preference in the process of online paper submission. However, please note that the Technical Program Committee has the right to make a final decision on the type of presentation associated with each paper.

Accepted IEEE EDTM 2023 papers will be considered for competition for the Best Paper Award, Best Student Paper Awards and Best Poster Awards.

More details on paper submission can be found at the Paper Submission.

Partial travel supports may be requested by students from the IEEE recognized financially challenged countries to present their accepted papers at the conference.

Important Dates for Authors

Paper Submission Starts	August 31, 2022 September 12, 2022	Paper Submission Deadline	October 31, 2022 November 14, 2022 November 30, 2022 (KST)
Notification of Acceptance	December, 2022 December 21, 2022	IEEE EDTM 2023 Conference	March 7-10, 2023

Registration Requirement