COMMITTEE | IEEE EDTM 2022 | 6th IEEE Electron Devices Technology and Manufacturing

Steering Committee
EDS VP of Meetings and Conferences (Chair)	Kazunari Ishimaru	Kioxia
EDS President	Ravi Todi	Western Digital
EDS Jr. Past President	Fernando Guarin	Globalfoundries
EDS Sr. Past President	Samar Saha	Prospicient Devices
EDS Secretary	M.K. Radharkrishnan	NanoRel
EDS Treasurer	Bin Zhao	Iotelligent
EDTM 2017 General Chair	Shuji Ikeda	tei Solutions
EDTM 2018 General Chair	Hitoshi Wakabayashi	Tokyo Institute of Technology
EDTM 2019 General Chair	Geok Ing Ng	Nanyang Technological University
EDTM 2021 General Chair	Albert Wang	University of California, Riverside

Executive Committee
General Chair	Kazunari Ishimaru	Kioxia
General Co-Chair	Changrock Song	SK Hynix
Technical Program Committee Chair	Masumi Saitoh	Kioxia
Technical Program Committee Vice-chair	KangWook Lee	SK Hynix
Education/Short-course/Tutorial Chair	Navakanta Bhat	Indian Institute of Science
Education/Short-course/Tutorial Vice-chair	P. Susthitha Menon	Universiti Kebangsaan Malaysia
Publications Chair	Hitoshi Wakabayashi	Tokyo Institute of Technology
Publicity Chair	Masaharu Kobayashi	The University of Tokyo
Publicity Vice-chair	Pei-Wen Li	National Yang Ming Chiao Tung University
Secretary	Kensuke Ota	Kioxia
Emerging Technologies Committee Chair	John Dallessase	University of Illinois at Urbana-Champaign
Emerging Technologies Committee Vice-chair	Huaqiang Wu	Tsinghua University
Financial Committee Chair	Iriya Muneta	Tokyo Institute of Technology
Financial Committee Vice-chair	Bin Zhao	Iotelligent
Sponsorship & Exhibition Chair	Shuji Ikeda	tei Solutions
Sponsorship & Exhibition Vice-chair	Aabid Husain	Atomera
Special Session Chair	Shinichi Ogawa	AIST
Special Session Co-Chair	Shuji Ikeda	tei Solutions
International Advisory Committee Chair	Tsu-Jae King Liu	University of California, Berkeley
Industrial Advisory Committee Chair	Meikei Ieong	HiTech
Industrial Advisory Committee Vice-chair	Mukta Farooq	IBM
North American Arrangement Committee Chair	Murty Polavarapu	BAE
European Arrangement Committee Chair	Merlyne de Souza	The University of Sheffield
European Arrangement Committee Vice-chair	Benjamin Iniguez	Universitat Rovira Virgili
Region 9 Arrangement Committee Chair	Edmundo A. Gutierrez-D	INAOE

Technical Program Committee (TPC)
Subcommittee: Materials
Chair	Pei-Wen Li	National Yang Ming Chiao Tung University
Vice-chair	Samit Ray	Indian Institute of Technology Kharagpur
Member	Saptarshi Das	The Pennsylvania State University
Member	Kazuhito Matsukawa	SUMCO
Member	Xiaodong Pi	Zhejiang University
Member	Muhammad Mustafa Hussain	University of California, Berkley
Member	C. J. Su	National Yang Ming Chiao Tung University
Member	Peter Littlewood	University of Chicago
Member	Lain-Jong (Lance) Li	The University of Hong Kong
Member	Milan Pesic	Applied Materials
Member	Hiroyasu Yamahara	The University of Tokyo
Member	Francesca Iacopi	University of Technology Sydney

Subcommittee: Process, Tools, Yield, and Manufacturing
Chair	Makoto Miura	Hitachi High-Tech
Vice-chair	Angelo Pinto	Qualcomm
Member	Ming Li	Peking University
Member	Anupam Mitra	Kioxia
Member	Keiichi Nakazawa	Sony Semiconductor
Member	Shawn Thomas	Applied Materials
Member	Walter Schwarzenbach	Soitec
Member	Yoshiki Yamamoto	Renasas
Member	Huimei Zhou	IBM
Member	Tomasz Brozek	PDF Solutions
Member	Kim SangHyeon	Korea Advanced Institute of Science and Technology
Member	Yasushi Akasaka	Tokyo Electron
Member	Yao-Jen Lee	TSRI
Member	Tien-Sheng Chao	National Yang Ming Chiao Tung University
Member	Saurabh Lodha	Indian Institute of Technology Bombay

Subcommittee: Semiconductor Devices
Chair	Jiezhi Chen	Shandong University
Vice-chair	Masaharu Kobayashi	The University of Tokyo
Vice-chair	Gong Xiao	National University of Singapore
Member	Yuichiro Mitani	Tokyo City University
Member	Kimihiko Kato	AIST
Member	Kuniyuki Kakushima	Tokyo Institute of Technology
Member	Runsheng Wang	Peking University
Member	Bin Gao	Tsinghua University
Member	Yogesh Singh Chauhan	Indian Institute of Technology, Kanpur
Member	Naoto Horiguchi	imec
Member	Roger Booth	Qualcomm
Member	Wei Cao	Intel
Member	Han Wang	TSMC
Member	Miaomiao Wang	IBM
Member	Wansik Hwang	Korea Aerospace University
Member	Zhigang Ji	Shanghai Jiao Tong University
Member	Seulki Park	Samsung

Subcommittee: Memory Technologies
Chair	Shimeng Yu	Georgia Institute of Technology
Vice-chair	Tuo-Hung Hou	National Chiao Tung University
Member	Hugh Barnaby	Arizona State University
Member	Qiangfei Xia	University of Massachusetts at Amherst
Member	Kai Ni	Rochester Institute of Technology
Member	Wilman Tsai	Stanford University
Member	Jianshi Tang	Tsinghua University
Member	Bing Chen	Zhejiang University
Member	Reika Ichihara	Kioxia
Member	Yangying Chen	Western Digital
Member	Elisa Vianello	CEA-Leti
Member	Jeng-Hua Wei	ITRI
Member	Xinyu Bao	TSMC
Member	Jiyong Woo	Kyungpook National University
Member	Uwe Schroeder	NamLab

Subcommittee: Photonics, Imaging and Display
Chair	Zhiyong Fan	Hong Kong University of Science and Technology
Vice-chair	Guozhen Shen	Institute of Semiconductors, CAS
Member	Gang Li	Hong Kong Polytechnic University
Member	Kai Wang	Sun Yat-Sen University
Member	Hang Zhou	Peking University
Member	Chuan Wang	Washington University in St Louis
Member	Qihua Xiong	Tsinghua University
Member	Euan Mcleod	University of Arizona
Member	Shang-Hua Yang	National Tsing Hua University
Member	Hong Lu	Nanjing University
Member	Tomohiro Amemiya	Tokyo Institute of Technology
Member	Sarvagya Paavan Dwivedi	imec
Member	Mitsuru Takenaka	The University of Tokyo

Subcommittee: Power and Energy Devices
Chair	Kejun Xia	TSMC
Vice-chair	Rongming Chu	Penn State University
Vice-chair	Wai Tung Ng	University of Toronto
Member	Moufu Kong	University of Electronic Science and Technology of China
Member	Uttam Singisetti	University at Buffalo, The State University of New York
Member	Yu Cao	FastPower
Member	Carol Zhan	ON Semiconductor
Member	Ray Hueting	University of Twente
Member	Man Hoi Wong	University of Massachusetts Lowell
Member	Qian Sun	Suzhou Institute of Nano-Tech and Nano-Bionics
Member	Shu Yang	Zhejiang University
Member	Ho-Young Cha	Hongik University
Member	Wataru Saito	Kyushu University
Member	Hiroshi Yano	University of Tsukuba
Member	Marina Antoniou	University of Warwick
Member	Wuxia Li	NXP

Subcommittee: Modeling and Simulation
Chair	Paul Zhou	ADI
Vice-chair	Guofu Niu	Auburn University
Vice-chair	Chika Tanaka	Kioxia
Member	Lan Wei	University of Waterloo
Member	Sourabh Khandelwal	Macquarie University
Member	Darsen Lu	National Cheng Kung University
Member	Dondee Navarro	Kioxia
Member	Victor Moroz	Synopsys
Member	Slobodan Mijalkovic	Silvaco
Member	Elena Gnani	University of Bologna
Member	Risho Koh	Renesas
Member	Mansun Chan	The Hong Kong University of Science and Technology
Member	Xingsheng Wang	Huazhong University of Science and Technology
Member	Peng Huang	Peking University
Member	Prezemyslaw Gromala	Robert Bosch GmbH
Member	Harshit Agarwal	Indian Institute of Technology, Jodhpur
Member	Feng Xu	Tsinghua University
Member	Brian Swahn	ADI
Member	Lining Zhang	Peking University Shenzhen

Subcommittee: Reliability
Chair	Zakariae Chbili	Intel
Vice-chair	Stanislav Tyaginov	imec
Member	Fransesco Maria Puglisi	University of Modena
Member	Rhagavan Nagarajan	Singapore University of Technology
Member	Pragya Shrestha	National Institute of Standards and Technology
Member	Kristina Young	Globalfoundries
Member	Charles Larow	Intel
Member	Gerhard Rzepa	GTS
Member	Suzanna Regianni	University of Bologna
Member	Yasuo Cho	Tohoku University
Member	Koji Eriguchi	Kyoto University

Subcommittee: Packaging and Heterogeneous Integration
Chair	Yasumitsu Orii	Nagase
Vice-chair	Akihiro Horibe	IBM Research Tokyo
Member	Masashi Nakazawa	SONY
Member	Atsushi Takahashi	Nagase
Member	Jian Cai	Tsinghua University
Member	Shin-Puu Jeng	TSMC
Member	Wei-Chung Lo	ITRI
Member	Gu-Sung Kim	Kangnam University
Member	Xiaowu Zhang	IME Singapore
Member	Wei Keat Loh	Intel Malaysia
Member	Yong Liu	ON Semiconductor
Member	Tanja Braun	Fraunhofer IZM

Subcommittee: Sensor, MEMS, Bio-Electronics
Chair	Xinxin Li	SIMIT CAS
Vice-chair	Jiahao Zhao	Tsinghua University
Vice-chair	Tian-Ling Ren	Tsinghua University
Member	Zhenhua Tian	Mississippi State University
Member	Hung Cao	University of California, Irvine
Member	Wei Wang	Peking University
Member	Hongyu Yu	The Hong Kong University of Science and Technology
Member	Dan Preston	Rice University
Member	Jingjing Zhao	Stanford University
Member	Jun Chen	University of California, Los Angeles
Member	Shuji Tanaka	Tohoku University
Member	Beomjoon Kim	The University of Tokyo

Subcommittee: Flexible and Wearable Electronics
Chair	Luisa Petti	Free University of Bozen-Bolzano
Vice-chair	Almudena Rivadeneyra	University of Granada
Vice-chair	Feng Yan	Hong Kong Polytechnic University
Member	Xiaojun Guo	Shanghai Jiao Tong University
Member	Francesca Bottacchi	FlexEnable
Member	Niels Benson	University of Duisburg-Essen
Member	Radu Sporea	University of Surrey
Member	Alwin Daus	RWTH Aachen University
Member	Dimitra Georgiadeu	University of Southampton
Member	Julio Costa	PragmatIC
Member	Linrun Feng	LinkZill
Member	Hendrik Faber	King Abdullah University of Science and Technology
Member	Manuela Ciocca	Free University of Bozen-Bolzano
Member	Giorgio dell'Erba	FLEEP Technologies
Member	Martina Aurora Angeli Costa	Free University of Bozen-Bolzano
Member	Dianne Corsino Cabrejas	Nara Institute of Science and Technology
Member	Akiko Ohata	High Energy Accelerator Research Organization
Member	Juan Paolo Bermundo	Nara Institute of Science and Technology

Subcommittee: Nanotechnologies
Chair	Stephen Goodnick	Arizona State University
Vice-chair	Xinran Wang	Nanjing University
Member	Mario Lanza	King Abdullah University of Science and Technology
Member	Qing Tu	Texas A&M University
Member	Fengqiu (Frank) Wang	Nanjing University
Member	Wolfgang Porod	University of Notre Dame
Member	Trevor Thornton	Arizona State University
Member	Yonhua Tseng	National Cheng Kung University,
Member	Yoshitaka Okada	The University of Tokyo
Member	Toshifumi Irisawa	AIST
Member	Kosuke Nagashio	The University of Tokyo
Member	Huamin Li	University at Buffalo, The State University of New York
Member	Manabu Ohtomo	Fujitsu

Subcommittee: Disruptive Technologies - IoT, AI/ML, Neuromorphic & Quantum Computing
Chair	Yuchao Yang	Peking University
Vice-chair	Gina Adam	George Washington University
Member	Can Li	Dalian Institute of Chemical physics. Chinese Academy of Sciences
Member	Xiaojian Zhu	Chinese Academy of Sciences
Member	Adnan Mehonic	University College London
Member	Xizhu Peng	University of Electronic Science and Technology of China
Member	Shaodi Wang	WITINMEM
Member	Zhichao Zack Lv	Reliance Memory
Member	Bonan Yan	Peking University
Member	Ying-Chen (Daphne) Chen	Northern Arizona University
Member	Changhwan Choi	Hanyang University
Member	Matthew W. Daniels	National Institute of Standards and Technology
Member	Changjing Wan	Nanjing University
Member	Takao Marukame	Toshiba

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