*Special Sessions on Integrated Materials are INCLUDED in the registration fee for Technical Sessions.

Organizer: Francesca Iacopi, University of Technology Sydney, Chair of EDS Materials Initiative Ad-Hoc Committee

Introduction: The two special sessions on Integrated Materials feature Invited Talks by experts of electronic materials and their integration in advanced silicon technologies. Topics covered are around the key role of materials for enabling computing paradigms beyond CMOS, including quantum and neuromorphic, and for enabling integration and reliability of electronic devices. The sessions will conclude with an hour -long panel discussions with the Speakers and additional expert panelists, where all attendees will be invited to join in. The topic will be pathways to foster increased Academia-Industry collaborations to accelerate materials impact in electronic devices.

Session 1

Date: Monday, March 7, 2022
Time: 16:00-19:00 (JST)

Chair: Francesca Iacopi, University of Technology Sydney
Pei-Wen Li, National Yang Ming Chiao Tung University

Introduction: 16:00-16:10 by Chair

Talk 1: 16:10-16:40

	Some Key Process Enablers for 3D Sequential Integrations
	Sylvain Maitrejean	CEA-Leti
	Abstract

Talk 2: 16:40-17:10

	Interface Design for Advanced Ge FETs - What is Different between Ge and Si? -
	Akira Toriumi	The University of Tokyo
	Abstract

Talk 3: 17:10-17:40

	Beyond CMOS – From Materials to Devices
	Maria Merlyne De Souza	University of Sheffield
	Abstract

Talk 4: 17:40-18:10

	Integration of Memristor with Capacitor and Resistors to Configure a Physical Kernel for Neuromorphic Applications
	Cheol Seong Hwang	Seoul National University
	Abstract

Panel Discussion: 18:15-19:00

Panelists: Speakers of Session 1 and Heike E. Riel, IBM Research

Session 2

Date: Tuesday, March 8, 2022
Time: 9:00-12:00 (JST)

Chair: Paul Berger, The Ohio State University
Albert Chin, National Yang Ming Chiao Tung University

Introduction: 9:00-9:10 by Chair

Talk 1: 9:10-9:40

	Oxide Heterostructures for Classical and Quantum Memories
	Supratik Guha	University of Chicago and Argonne National Laboratory

Talk 2: 9:40-10:10

	Charge Trapping and Its Impact on Devices and Circuits
	Gilson Wirth	Federal University of Rio Grande do Sul
	Abstract

Talk 3: 10:10-10:40

	Mind the Gap: Integrating Materials and Engineering Research
	Paul A. Lane	National Science Foundation

Talk 4: 10:40-11:10

	Advanced Interconnect Technology for Next Gen Computing
	Griselda Bonilla	IBM Yorktown

Panel Discussion: 11:15-12:00

Panelists: Speakers of Session 2