Program at a Glance and Program Details
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3rd March 2024, Sunday 09:30 AM – 01:00 PM
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Tutorials |
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T1. Wide Bandgap Devices for RF and Power Applications | ||
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Session Room: TBD |
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Session Chair: Prof. Sushobhan Avasthi |
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[T1-1] GaN Power Transistors: Technology and Applications Ken Shono; Transphorm Japan |
09:30 AM – 11:00 AM | |
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[T1-2] GaN Microwave/RF Transistors: From Fundamentals to Emerging Trends Digbijoy Nath; Indian Institute of Science Bangalore, India |
11:30 AM – 01:30 PM | |
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T2. Reliability in Advanced Semiconductor Devices |
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Session Room: TBD |
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Session Chair: Dr. Taiki Uemura |
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[T2-1] A Device to Circuit Framework for Aging (BTI, HCD) in Advanced Technology Nodes Souvik Mahapatra; Indian Institute of Technology Bombay, India |
09:30 AM – 11:00 AM | |
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[T2-2] Insulators for Devices based on 2D Materials Tibor Grasser; Institute of Microelectronics, TU Wien, Austria |
11:30 AM – 01:00 PM | |
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T3. Artificial Neural Networks |
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Session Room: TBD |
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Session Chair: Prof. Shubham Sahay |
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[T3-1] In-Memory Computing for Artificial Neural Networks Abu Sebastien; IBM Research Zurich, Switzerland |
09:30 AM – 11:00 AM | |
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[T3-2] Biologically Realistic Artificial Neural Networks Veeresh Deshpande; Indian Institute of Technology Bombay, India |
11:30 AM – 01:00 PM | |
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T4. TCAD and Compact Modeling |
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Session Room: TBD |
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Session Chair: Prof. Avinash Lahgere |
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[T4-1] Compact Modeling: General Introduction and Modeling of Statistical Variability Gert-Jan Smit; NXP Semiconductors, The Netherlands |
09:30 AM – 10:30 AM | |
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[T4-2] MOSFET Characterisation and Modeling for Cryogenic Applications Thomas Bedecarrats; CEA-Leti, Grenoble, France |
10:30 AM – 11:30 PM | |
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[T4-3] TCAD-based Compact Model Parameter Extraction of Si and SiC High Power Devices D. Vinay Kumar; Synopsys India |
12:00 AM – 01:00 PM | |
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3rd March 2024, Sunday 02:30 PM – 06:00 PM
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Short Courses |
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SC1. Advances in Logic Devices |
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Session Room: TBD |
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Session Chair: Prof. Saurabh Lodha |
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[SC1-1] Logic Technology Roadmap Gaurav Thareja; Applied Materials, USA |
02:30 PM – 04:00 PM | |
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[SC1-2] Nanosheet-based Transistor Architectures for Advanced CMOS Scaling Hans Mertens; IMEC Leuven, Belgium |
04:30 PM – 06:00 PM | |
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SC2. Advances in Memory Technologies |
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Session Room: TBD |
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Session Chair: Prof. Udayan Ganguly |
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[SC2-1] DRAM and NAND Memories: Technology and Design Perspectives Partha Parthasarathy; Micron Technology, India |
02:30 PM – 04:00 PM | |
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[SC2-2] DRAM Scaling: History and Innovation Sungho Jang; Samsung Electronics, South Korea |
05:00 PM – 06:00 PM | |
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SC3. Semiconductor Packaging Technology |
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Session Room: TBD |
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Session Chair: Prof. Shree Prakash Tiwari |
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[SC3-1] Fan-out Semiconductor Packaging: Evolution, Current Status and Future Trends Santosh Kumar; Reliance, India |
02:30 PM – 04:00 PM | |
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[SC3-2] Recent Advancements in Interconnect Materials and Technologies in Semiconductor Packaging Nilesh Badwe; Indian Institute of Technology Kanpur, India |
04:30 PM – 06:00 PM | |
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4th March 2024(Monday)
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Time | Room # | Room # | Room # | Room # | Room # | Room # | Room # | Room # | Room # |
| 09:00 AM - 09:30 AM | Inauguration Ceremony | |||||||||
| 09:30 AM - 10:20 AM | Plenary - 1 (Chenming Hu - Semiconductor- The Next 75 Years) | |||||||||
| 10:20 AM - 11:10 AM | Plenary - 2 (Sameer Pendharkar - GaN Technology enabling Power Electronics) | |||||||||
| 11:10 AM - 11:30 AM | Tea, Coffee, Networking | |||||||||
| 11:30 AM - 01:00 PM | 1A | 1B | 1C | 1D | 1E | 1F | 1G | 1H | 1J | |
| CMOS Technology Scaling | RF, Millimetre and Terahertz Technologies, Circuits and Systems | TCAD and Manufacturing | Emerging Memory Technologies | Ferroelectric Materials and Devices I | WBG Device Applications | Packaging Materials | 2D Sensors | |||
| 01:00 PM - 02:00 PM | Lunch, Networking | |||||||||
| 02:00 PM - 03:30 PM | 2A | 2B | 2C | 2D | 2E | 2F | 2G | 2H | 2J | |
| Design Technology Co-Optimization I | Neuromorphic Computing I | TCAD Simulation | Ferroelectric Memories | 2D Materials and Devices I | High Power Device Reliability | Packaging - Mechanical Properties and Reliability | Microfluidics and MEMS Sensors | Technology For Future Chips | ||
| 03:30 PM - 03:45 PM | Tea, Coffee, Networking | |||||||||
| 03:45 PM - 05:15 PM | 3A | 3B | 3C | 3D | 3E | 3F | 3G | 3H | 3J | |
| Semiconductor Device Characterization | Neuromorphic Computing II | TCAD and Device Modelling | Ferroelectric FETs | Neuromorphic Devices | SiC based Power Devices | Memory and Metallization Reliability | Yield and Manufacturing | |||
| 05:15 PM - 05:45 PM | Tea, Coffee, Networking | |||||||||
| 05:45 PM - 07:30 PM | Poster Session 1 | Young Professionals (YP) Event | ||||||||
| 08:00 PM - 10:30 PM | Dinner, Networking | |||||||||
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5th March 2024(Tuesday)
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Time | Room # | Room # | Room # | Room # | Room # | Room # | Room # | Room # | Room # |
| 09:00 AM - 09:50 AM | Plenary - 3 (Balajee Sowrirajan - Semiconductor Systems Driving AI) | |||||||||
| 09:50 AM - 10:40 AM | Plenary - 4 (Thomas Mikolajick - From Ferroelectric materials to Enhanced Semiconductor Devices) | |||||||||
| 10:40 AM - 11:00 AM | Tea, Coffee, Networking | |||||||||
| 11:00 AM - 01:00 PM | 4A | 4B | 4C | 4D | 4E | 4F | 4G | 4H | ||
| Gate-All-Around (GAA) Devices | In-Memory Computing I | Cryogenic CMOS Compact Modeling | 2D Materials and Devices II | Ai/ML in Process Control | Package Manufacturing | Logic and 2D Material Reliability | Si, SiGe, III-V Technologies for RF Applications | |||
| 01:00 PM - 02:00 PM | Lunch, Networking | |||||||||
| 02:00 PM - 03:30 PM | 5A | 5B | 5C | 5D | 5E | 5F | 5G | 5H | ||
| Alternate Devices and Computing Options | Flash Memories | Ab-Initio Simulation and Modeling | 2D Materials and Devices III | Sensors and Biosensors I | Integrated Photonics I | Ga2O3-based Power Devices | SOI Devices for RF Applications | |||
| 03:30 PM - 03:45 PM | Tea, Coffee, Networking | |||||||||
| 03:45 PM - 05:15 PM | 6A | 6B | 6C | 6D | 6E | 6F | 6G | |||
| Ferroelectric Materials and Devices II | Unconvention al Computing I | Design Technology Co-Optimization II | Optoelectronic Devices | Sensors and Biosensors II | Integrated Photonics II | Solar Cells | GaN HEMTs for RF Applications | |||
| 05:15 PM - 05:45 PM | Tea, Coffee, Networking | |||||||||
| 05:45 PM - 07:30 PM | Poster Session II | WiEDS | ||||||||
| 08:00 PM - 10:30 PM | Dinner, Networking | |||||||||
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6th March 2024(Wednesday)
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Time | Room # | Room # | Room # | Room # | Room # | Room # | Room # | Room # | Room # |
| 09:00 AM - 09:50 AM | Plenary - 5 (Anand Murthy - Transistor Scaling for the Future) | |||||||||
| 09:50 AM - 10:40 AM | Plenary - 6 (Srinivas Raghvendra - Simulation and Analytics in the Angstrom Era) | |||||||||
| 10:40 AM - 11:00 AM | Tea, Coffee, Networking | |||||||||
| 11:00 AM - 01:00 PM | 7A | 7B | 7C | 7D | 7E | 7F | 7G | 7H | ||
| Design Technology Co-optimization III | In-Memory Computing II | ML based Device Modeling | RRAM and OTS Selected Crossbar Arrays | Thin Film Devices | Process and Metrology | Package Design | Printed Devices | |||
| 01:00 PM - 02:00 PM | Lunch, Networking | |||||||||
| 02:00 PM - 04:00 PM | 8A | 8B | 8C | 8D | 8E | 8F | ||||
| GaN based Power Devices | In-Memory Computing III | Ferroelectric/Memory Modeling | Unconvention al Computing II | Magnetic, Straintronic and Quantum Computing Devices | MEMS Devices | Student Research Forum | ||||
| 04:00 PM - 04:30 PM | Tea, Coffee, Networking | |||||||||
| 04:30 PM - 06:00 PM | Closing Ceremony and Awards | |||||||||
| 07:00 PM - 09:30 PM | Thanks Giving Dinner | |||||||||