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Call for Papers

Call for Papers PDF

We cordially invite you to submit ORIGINAL 3-page Camera-Ready papers to the 2024 IEEE Electron Devices Technology and Manufacturing (IEEE EDTM 2024) Conference for possible presentations. Original papers are sought on any topic within the scope of IEEE EDTM 2024.

Topics for IEEE EDTM 2024

    Group IV devices; Compund semiconductor and oxide semiconductor devices; CMOS platform technologies; Innovative device concepts like tunnel FETs, negative capacitance FETs,GAA nanowires and nanosheet based devices.

    Device technologies related to high voltage devices, power/RF devices, energy harvesting devices, photovoltaics,energy storage devices, discrete/integrated power devices, power modules/systems; Power device structures such as diodes, BJTs, FETs, IGBTs; Power device materials such as wide bandgap and ultra-wide bandgap materials (SiC, GaN, GaAs, AIN, GaO etc.); Power device fabrication processes, modeling and simulation

    Discrete and integrated high frequency (micro, mm-wave and THz) devices and physics, modules and systems, III-V devices for RF/THz application, Passive component device for RF/THz

    Logic device performance and circuit device challenges, Device-circuit co-design, System technology co-optimization (STCO), Design Automation, AI/ML system design, CPU Microarchitecture, Domain specific accelerators, Memory Systems, System-level projections.

    2D devices on low-dimensional materials; Neuromorphic and approximate computing devices; Spintronic and magnetic devices; Quantum computing devices; Topological materials and devices; Phase transition materials; Novel low-temperature or cryogenic devices.

    All memories including embedded/standalone memories, volatile/nonvolatile memories; Emerging memories like RRAM, MRAM, PCM, FeRAM, cross-points/selectors, bio-inspired memory; Memory scaling; characterization and conventional and emerging memories.

    Semiconductor processes and process tools including process modules (deposition, dry/wet etch, cleaning, planarization, isolation, dielectrics, metals, silicides, lithography, self-assembly techniques); Process integration; Process control; Impact of process tools on devices/reliability; Process sensing; Process enhancement through AI/ML; Semiconductor manufacturing technologies and yield enhancement; Clean-room management; Wafer handling; Design-for-manufacturability (DFM); Design-for-test (DFT); Yield management using sensing, Computational lithography.

    Advances in packaging and heterogeneous integration technologies including 2.1D, 2.5D and 3D integrations; Advanced packaging and manufacturing technologies such as wafer- level packaging, chiplets, ultra-fine-pitch interconnection, sub-micron package-level wiring, optical/wireless interconnect, power/sensor device packaging, controlling thermal-expansion coefficient, thermal management.

    Advances in modeling/simulation of devices, packages and processes; Technology CAD and benchmarking; Atomistic process and device simulation; Compact models for DTCO and STCO; AI/ML-augmented modelling; Material and interconnect modeling; Models for photonic devices.

    Reliability of FEOL/MOL/BEOL; ESD and latch-up; Reliability of devices, circuits and systems; Design for reliability and variability aware design; Degradation mechanism of emerging devices and memories; Reliability of neuromorphic computing systems; Robustness and security of electronic circuits and systems; Reliability of cryogenic devices for future quantum computing applications.

    Heterogenous optoelectronic integration including sources, modulators and detectors; Optoelectronic integration for neuromorphic computing; Single photon devices; Displays and imagers for augmented virtual reality; Topological optoelectronics and photonics; Intelligent image sensors; Photonics for energy; Microwave photonics; Nano-photonics.

    Advances in sensors, transducers and actuators; Bio-sensors; Sensors for environmental monitoring (agri-sensors, gas-sensors); Sensors for process monitoring; Physical and biochemical integrated sensors; Flexible devices for wearable applications; Materials for flexible electronics; Intelligent sensors with embedded AI; Sensors and devices for human-machine interface.

    MEMS/NEMS devices; MEMS for internet of things; Microfluidics and BioMEMS; CMOS on MEMS; RF MEMS; Micro-optical and opto-chemical devices; Micro-power generators; MEMS for energy harvesting and on-chip energy storage.

    Topics on disruptive technologies including quantum computing, in-memory, neuromorphic and bio-inspired computing; AI/ML for next generation computing, Quantum machine learning, Logic-in-memory.

Authors should follow the detailed descriptions in the paper template to prepare their manuscripts.

Download the Word Template WORD Download the Latex Template

Submitted papers will be subjected to IEEE standard review processes and publishing guidelines, as well as IEEE EDTM 2024 review criteria. The accepted and presented papers will be included in the IEEE EDTM 2024 Proceedings (Camera-Ready at submission and to be published AS IS if accepted), which will be published in IEEE Xplore. The authors of a selected high-impact papers will be invited to submit extended versions for possible publication in the Special Issue on IEEE EDTM 2024 in IEEE Journal of Electron Devices Society (J-EDS), subjected to J-EDS author guidelines, and standard IEEE review and publication policy.

Presentation formats of contributed papers are oral or poster, and authors can indicate their preference in the process of online paper submission. However, please note that the Technical Program Committee has the right to make a final decision on the type of presentation associated with each paper.

Accepted IEEE EDTM 2024 papers will be considered for competition for the Best Paper Award, Best Student Paper Awards and Best Poster Awards.

More details on paper submission can be found at the Paper Submission.

Important Dates for Authors

Paper Submission Starts August 1, 2023 Paper Submission Deadline October 15 November 14, 2023 (IST)
Notification of Acceptance December 15 December 18, 2023 IEEE EDTM 2024 Conference March 3-6, 2024

Registration Requirement

All presenting authors are advised to complete the advance registration by January 15, 2024.

Previous IEEE EDTM papers published in IEEE Xplore can be reviewed at:

  1. IEEE EDTM2017
  2. IEEE EDTM2018
  3. IEEE EDTM2019
  4. IEEE EDTM2020
  5. IEEE EDTM2021
  6. IEEE EDTM2022