Technical Program Committee (TPC)
Group I: Medical Ultrasonics
Vice Chair of TPC:
Jan D'hooge
Katholieke Universiteit Leuven
Leuven, Belgium
Members:
Olivier Basset, CREATIS, Lyon, France
Ayache Bouakaz, INSERM, Tours, France
Charles Cain, Univ. of Michigan, USA
Jean-Yves Chapelon, INSERM, Lyon, France
Greg Clement, Harvard Medical School, USA
Paul Dayton, Univ. North Carolina/NCSU, USA
Emad Ebbini, Univ. of Minnesota, USA
Stanislav Emelianov, Univ. of Texas at Austin, USA
David Evans, Univ. of Leicester, UK
Kathy Ferrara, Univ. of California Davis, USA
Stuart Foster, Univ. of Toronto, Canada
James Greenleaf, Mayo Clinic, USA
Anne Hall, GE medical systems, USA
Christopher Hall, Philips Research, USA
Peter Hoskins, Univ. of Edinburgh, UK
John Hossack, Univ. of Virginia, USA
Kullervo Hynynen, Univ. of Toronto, Canada
Jorgen Jensen, Technical Univ. of Denmark, Denmark
Chris de Korte, Catholic Univ. of Nijmegen, the Netherlands
Nico de Jong, Erasmus Medical Centre, the Netherlands
Jeff Ketterling, RiversideNew York, USA
Michael Kolios, Ryerson University, Canada
Hiroshi Kanai,Tohoku University, Japan
Nobuki Kudo, Hokkaido University, Japan
Pai-chi Li, National Taiwan University, Taiwan
Jian-yu Lu, Univ. of Toledo, USA
Tom Matula, Univ. of Washington, USA
Leonardo Masotti, Univ. Of Firenze, Italy
James G. Miller, Washingon University, USA
Kathy Nightingale, Duke University, USA
Svetoslav Nikolov, BK Medical, Denmark
William O’Brien, Univ. of Illinois at Urbana-Cham., USA
Georg Schmitz, Ruhr-Universität Bochum, Germany
Ralf Seip, Philips Research, USA
Mickael Tanter, University Paris VII, France
Tom Thomas, Boston Scientific, USA
Kai Thomenius, GE’s corporate R&D, USA
Hans Torp, Univ. of Science&Technology, Norway
Piero Tortoli, Univ. of Firenze, Italy
Ton van der Steen, Erasmus Medical Centre, the Netherlands
Kendall Waters, Silicon Valley Med. Instruments, USA
Keith Wear, Food and Drug Administation, USA
Group II: Sensors, NDE, and Industrial Application
Vice Chair of TPC:
Jafar Saniie, Ph.D.
Illinois Institute of Technology
Chicago, Illinois, U.S.A.
Members:
Robert C. Addison: Rockwell Science Center, USA
Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany
Michal Bezdek: Endress+Hauser Flowtec AG, Switzerland
Ramazan Demirli: Canfield Scientific, USA
Eric S. Furgason: Purdue University, USA
David Greve: Carnegie Mellon University, USA
Edward Haeggstrom: University of Helsinki, Finland
Mitsutaka Hikita: Kogakuin University, Japan
Jacqueline Hines: Applied Sensor Research and Development Corporation, USA
Fabien J. Josse: Marquette University, USA
Lawrence W. Kessler: Sonoscan Inc., USA
Pierre T. Khuri-Yakub: Stanford University, USA
Mario Kupnik: Stanford University, USA
Jun-ishi Kushibike: Tohoku University, Japan
Roman Maev: University of Windsor, Canada
Kentaro Nakamura: Tokyo Institute of Technology
Massimo Pappalardo: University Roma Tre, Italy
Tony Sinclair: University of Toronto, Canada
Bernhard Tittman: Pennsylvania State University, USA
Jiromaru Tsujino: Kanagawa University, Japan
John F. Vetelino: University of Maine, USA
Paul Wilcox: University of Bristol, UK
Donald E. Yuhas: Industrial Measurement Systems, Inc., USA
Group III: Physical Acoustics
Vice Chair of TPC:
Yook-Kong Yong, Ph.D.
RutgersUniversity Piscataway, New Jersey, U.S.A.
Members:
Robert Aigner: TriQuint Semiconductor, USA
Art Ballato: U.S. Army, USA
Jan Brown: JB Consulting, USA
Weiqiu Chen: Zhejiang University, China
David Hecht: DLH Consulting, USA
Fred Hickernell: Retired from Motorola, USA
Yonkee Kim: U.S. Army, USA
Amit Lal: Cornell University, USA
C.S. Lam: Epson Electronics America, Inc., USA
John Larson: Avago Technologies, USA
Moises Levy: Department of Physics, Naples, Florida, USA
George Mansfeld: Russian Academy of Sciences, Russia
Vitold Poghar: Scientific and Technological Center of Unique Instrumentation of Russian Academy of Science, Russia
Valeri Proklov: Institute of Radio Engineering & Electricity, Russia
Edgar Schmidhammer: EPCOS, Germany
Susan Schneider: Marquette University, USA
Bikash Sinha: Schlumberger-Doll Research, USA
Ji Wang: Ningbo University, China
Qing-Ming Wang: University of Pittsburgh, USA
Group IV: Microacoustics - SAW, FBAW, MEMS
Vice Chair of TPC:
Clemmens Ruppel, Ph.D.
EPCOS AG - SAW RD SAM
Germany
Members:
Ben Abbott: Triquint, USA
Robert Aigner: Triquint, USA
Sylvain Ballandras: FEMTO-ST, France
Kushal Bhattacharjee: RF Micro Devices, USA
Sunil Bhave: Cormell University, USA
Sergey Biryukov: IFW Dresden, Germany
Paul Bradley: Avago, USA
Jidong Dai: RF Monolithics, USA
Omar Elmazria: Nancy Université - CNRS, France
Gernot Fattinger: Triquint, USA
Ken-ya Hashimoto: Chiba University, Japan
Daniel Hauden: FEMTO-ST, France
Shitang He: IACAS, China
Chunyun Jian: Nortel Networks, Canada
Michio Kadota, Murata, Japan
Jyrki Kaitila: Avago, Germany
Jan Kuypers: Sand 9, Inc., USA
Ken Lakin: Consultant, USA
Don Malocha: University of Central Florida, USA
David Morgan: Impulse Consulting, UK
Hiroyuki Odagawa: Tohoku University, Japan
Pensala Tuoma: VTT, Finland
Mauricio Pereira da Cunha: University of Maine, USA
Viktor Plessky: GVR Trade SA, Switzerland
Bob Potter: Vectron International, USA
Leonard Reindl: Albert-Ludwigs-University Freiburg, Germany
Richard Ruby: Avago, USA
Takahiro Sato: Samsung, Japan
Peter Smith: McMaster University, Canada
Marc Solal: Triquint, USA
Karl Wagner: EPCOS AG, Germany
Robert Weigel: Friedrich-Alexander University, Germany
Sergei Zhgoon: Moscow Power Engineering Institute, Russia
Group V: Transducers and Transducer Materials
Vice Chair of TPC:
Scott Smith, Ph.D.
GE Global Research
Niskayuna, New York, U.S.A.
Members:
Sandy Cochran: University of Dundee, UK
Christopher Daft: Siemens Medical Solutions, USA
Levent Degertekin: Georgia Institute of Technology, USA
Charles Emery: Mirabilis Medica, USA
John Fraser: Philips Healthcare, USA
Jean-Francois Gelly: GE Healthcare, France
Reinhard Lerch: Friedrich-Alexander-Universität Erlangen-Nuremberg, Germany
Geoff Lockwood: Queen's University, Canada
Clyde Oakley: W. L. Gore, USA
Omer Oralkan: Stanford University, USA
Paul Reynolds: Weidlinger Associates, USA
Yongrae Roh: Kyungpook National University, Korea
Arne Ronnekleiv: Norwegian University of Science and Technology, Norway
Ahmad Safari: Rutgers University, USA
Mark Schafer: Sonic Tech Inc., USA
Kirk Shung: University of Southern California, USA
Stephen Smith: Duke University, USA
Wallace Smith: Office of Naval Research, USA
Yasuhito Takeuchi: Kagoshima University, Japan
Jian Yuan: Boston Scientific, USA
Qiming Zhang: Pennsylvania State University, USA
Qifa Zhou: University of Southern California, USA
