Co-organizers

  • 中科芯未来
  • 成都高新区集成电路业界共治理事会
  • 成都国家现代服务业集成电路设计产业化基地

Platinum Sponsors

Gold Sponsors

Silver Sponsors

Bronze Sponsors

Copyright 2020-2021 EDTM.

All Rights Reserved.

Platinum SponsorsGold SponsorsSilver SponsorsBronze Sponsors
Soitec KIOXIA KEYSIGHT TECHNOLOGIES ROHDE & SCHWARZ Cadence ASM SILVACO 半导体三维集成制造创新中心 Synopsys Sony Semiconductor Solutions Lam Research 北方集成电路技术创新中心 ASML
EDTM2021 Virutal Plaform remains open until May 15, 2021. Please use your access codes to enjoy the presentations.
EDTM2021 Virtual Platform opens to registrants until May 15, 2021.
EDTM2021 is postponed to April 8-11, 2021.
Due to the 3rd wave of COVID-19 around the world, the local government has a new policy that prohibits any large meetings until March 31, 2021. We have been closely monitoring the global pandemic development. Fortunately, the recent statistics clearly show that the new COVID-19 cases started to drop dramatically worldwide, particularly in China (Chengdu). It is hence expected that large meetings will be allowed after March 31, 2021. In order to keep a Hybrid conference with the promised FUN/in-person meetings/activities, EDS decided to reschedule EDTM2021 to April 8-11, 2021 at the same venue with the same Program. The new meeting schedules will be announced online soon. Stay tuned please.
EDTM2021 will go HYBRID comprising:
  • A normal in-Person/on-Site meeting with large attendance and in-person FUN, and
  • Virtual Components for those with travel restriction due to COVID-19, including virtual presentation, participation and exhibition booths.

COVID-19 Watch: Chengdu remains safe. EDTM2021 is planned as an in-person/on-site event. Meanwhile, we are closely monitoring the development of global COVID-19 outbreak. A contingency plan will allow virtual presentations and participation for those with travel restrictions and concerns. Both safety and participation experiences will be ensured for EDTM2021.

What's New

2020.8.1
Paper submission started.
2020.5.19
Web site opened.
2020.10.25
Due to COVID-19, the paper submission deadline is extended to: November 7, 2020.
2021.1.12
Registration is open now.
2021.1.18
Preliminary Programbook is Available.