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The Heterogeneous Integration Roadmap (HIR) is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines. The HIR is sponsored by three IEEE Societies (Electronics Packaging Society, Electron Devices Societry & Photonics Society) together with SEMI and ASME EPPD.
This HIR workshop @ EDTM will feature seven selected topics from the HIR chapters including an overview presentation. The purposes for the HIR workshop at EDTM are to feature interest & stimulate collaboration for the HIR stakeholders around the world.
Organizing Committee: Chair: William Chen, Co-Chairs: Subramanian Iyer, WR Bottoms, Ravi Mahajan
|09:00 am – 09:05 am||Welcome EDTM & HIR|
|09:05 am – 09:30 am||HIR Overview: William Chen, WR Bottoms & Ravi Mahajun|
|09:30 am – 09:55 am||Automotive Electronics: Urmi Ray & Rich Rice|
|09:55 am – 10:20 am||SiP & Module: R. Aschenbrenner, Klaus Pressel, Erik Jung|
|10:20 am – 10:45 am||MEMS & Sensor Integration: Shafi Saiyed & MaryAnn Mahar|
|10:45 am – 11:10 am||Simulation & Co-Design: Christopher Bailey & Xuejun Fan|
|11:10 am – 11:35 am||Reliability: Abjijit Desgupta, Richard Rao, Shubhana Sahasrabudha|
|11:35 am – 12:00 pm||Integrated Power Electronics: Patrick McCluskey & Douglas Hopkins|
|12:00 pm – 12:30 pm||Panel Session: Moderators: Subramanian Iyer & William Chen|
Note: Each Topical time slot is 25 minutes (total) including speaker introduction & brief Q&A.
Workshop Speakers & Panelists from HIR Techncial Working Groups:
HIR Overview Chapter: William (Bill) Chen (HIR & ASE) & WR (Bill) Bottoms (HIR & 3MTS, Chairman)
Automotive Technical Working Group: Chair & Co-Chair Urmi Ray (Consultant), & Rich Rice (ASE SVP Business Development)
SiP & Module Technical Working Group: Chair & Co-Chairs Rolf Aschenbrenneer (IZM), Klaus Pressel (Infineon), Erik Jung (IZM)
MEMS & Sensor Integration Technical Working Group: Chair & Co-Chair Shafi Saiyed (Analog Devices) & MaryAnn Maher (CEO, Soft MEMS)
Simulation Technical Working Group : Chair & Co-Chair Christopher Bailey (Greenwich University), Xuejun Fan (Lamar Uniuversity)
Reliability Technical Working Group: Chair & Co-Chairs Abjijit Desguta (U Maryland), Richard Rao (Inphi), Shubhana Sahasrabudha (Intel)
Integrated Power Electronics Technical Working Group: Chair & Co-Chair Patrick McCluskey (U Maryland) Douglas Hopkins(NC State)
Panel Session Moderators:
Subramanian Iyer (UCLA) & William Chen (HIR & ASE)