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PRESENTATION INFORMATION
VIRTUAL PARTICIPATION
⭐ Guidelines for Virtual Participation
⭐ Online Posters
⭐ Information of EDTM 2021 Presentions
PROGRAM
TUTORIAL & SHORT COURSES
HIR WORKSHOP
CALL FOR PAPERS
REGISTRATION
· Domestic Participants
· International Participants
PAPER SUBMISSION
⭐ Paper Awards
⭐ Best Interactive Paper Finalist
SPONSORSHIP & EXHIBITION
⭐ Virtual Booth
COMMITTEE
VENUE & ACCESS
SPECIAL EVENT
ACCOMMODATIONS
CONTACT
ACHIEVE
FUTURE CONFERENCE
Co-organizers
清华大学
北京未来芯片技术高精尖创新中心
电子科技大学
成都市集成电路行业协会
成都汀兰会展有限公司
中科芯未来
成都高新区集成电路业界共治理事会
成都国家现代服务业集成电路设计产业化基地
Platinum Sponsors
Gold Sponsors
Soitec
KIOXIA
KEYSIGHT TECHNOLOGIES
ROHDE & SCHWARZ
Cadence
ASM
SILVACO
半导体三维集成制造创新中心
Silver Sponsors
Synopsys
Sony Semiconductor Solutions
Lam Research
北方集成电路技术创新中心
Bronze Sponsors
ASML
Copyright 2020-2021
EDTM
.
All Rights Reserved.
CONTACT
Secretariat of
EDTM 2021
Chengdu Tinglan Meeting Co., Ltd.
Address:
8
th
Floor, Building B, Bloomington Plaza, Yizhou Ave. North,
Hi-Tech District, Chengdu, Sichuan, China
TEL:
+86 (028) 85096050
Mail:
edtm2021@163.com
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