COMMITTEE

Steering Committee
Names	Affiliations
Kazunari Ishimaru (Chair)	Kioxia Corporation, Japan
Ru Huang (Co-Chair)	Peking University, China
Meyya Meyyappan	NASA Ames, USA
Fernando Guarin	Globalfoundries, USA
Samar Saha	Prospicient Devices, USA
Ravi Todi	Western Digital, USA
Albert Wang	University of California, Riverside, USA
Tianchun Ye	Institute of Microelectronics, Chinese Academy of Science, China
Huaqiang Wu	Tsinghua University, China
Bin Zhao	EBI, USA
Tsu-Jae King Liu	University of California, Berkeley, USA
Xuecheng Zou	Huazhong University of Science and Technology, China
Ming Liu	Institute of Microelectronics, Chinese Academy of Science, China
Bo Zhang	University of Electronic Science and Technology of China, China

Executive Committee
Roles	Names	Affiliations
General Chair	Albert Wang	University of California, Riverside
General Co-Chair	Tianchun Ye	IME-CAS
TPC Chair	Huaqiang Wu	Tsinghua University
TPC Co-Chair	Subramanian Iyer	University of California, Los Angeles
International Advisory Committee Chair	Tsu-Jae King Liu	University of California, Berkeley
International Advisory Committee Co-Chair	Bin Zhao	EBI
Publications Chair	Jianshi Tang	Tsinghua University
Publications Co-Chair	Hitoshi Wakabayashi	Tokyo Institute of Technology
Publications Co-Chair	Yi Li	HUST
Education/Short-Course Chair	Tianling Ren	Tsinghua University
Education/Short-Course Co-Chair	Qiming Shao	HKUST
Education/Short-Course Co-Chair	Navakanta Bhat	IIT, Bangalore, India
Education/Short-Course Co-Chair	Yimao Cai	Peking University
Publicity Chair	Peng Zhou	Fudan University
Publicity Co-Chair	Mario Lanza	King Abdullah University of Science and Technology
Publicity Co-Chair	Srabanti Chowdhury	Stanford University
Financial Committee Chair	Bin Zhao	EBI
Financial Committee Co-Chair	Bin Gao	Tsinghua University
Sponsorship & Exhibition Chair	He Qian	Tsinghua University
Sponsorship & Exhibition Co-Chair	Xuecheng Zou	HUST
Sponsorship & Exhibition Co-Chair	Bill Nehrer	Applied Materials
Sponsorship & Exhibition Co-Chair	Aabid Husain	Atomera, Inc.
Emerging Technologies Committee Chair	Shuji Ikeda	Tei-Solutions
Emerging Technologies Committee Co-Chair	John Dallessase	UIUC
Emerging Technologies Committee Co-Chair	Qi Liu	Fudan University
Emerging Technologies Committee Co-Chair	He Tang	University of Electronic Science and Technology of China
Emerging Technologies Committee Co-Chair	Patrick Fay	University of Notre Dame
Conference Planning/Local Arrangement Chair	He Tang	UESTC
Conference Planning/Local Arrangement Co-Chair	Wanli Zhang	UESTC
Industrial Advisory Committee Chair	Meikei Ieong	HSMC
Industrial Advisory Committee Co-Chair	Anthony Yen	ASML
Industrial Advisory Committee Co-Chair	Judy Xilin An	Beijing Institute of Carbon-Based IC
Industrial Advisory Committee Co-Chair	Masumi Saitoh	Kioxia
North American Arrangement Committee Chair	Jesus A del Alamo	MIT
North American Arrangement Committee Co-Chair	Murty Polavarapu	BAE Systems
European Arrangement Committee Chair	Merlyne de Souza	University of Sheffield, UK
European Arrangement Committee Co-Chair	Benjamin Iniguez	University Rovira i Virgili, Spain
Region 9 Arrangement Committee Chair	Jacobus Swart	University of Campinas
Region 9 Arrangement Committee Co-Chair	Edmundo A. Gutierrez-D	INAOE, Mexico

Technical Program Committee (TPC)
Roles	Names	Affiliations
TPC Chair	Huaqiang Wu	Tsinghua University
TPC Co-Chair	Subramanian Iyer	University of California, Los Angeles
Materials Committee
Chair	Genquan Han	Xidian University
Co-Chair	Daniel Herr	University of North Carolina, Greensboro
Co-Chair	Xiaodong Pi	Zhejiang University
Members	Saptarshi Das	Pennsylvania State University
	Pei-Wen Li	National Chiao Tung University
	Kazuhito Matsukawa	SUMCO
	Yang Xu	Zhejiang University
	Muhammad Mustafa Hussain	KAUST
	Ni Zhong	East China Normal University
	Hongliang Lu	Fudan University
	Jiuren Zhou	National University of Singapore
	Hong Dong	Nankai University
	Yu Zhang	Jilin University
	Minoru Fujii	Kobe University
	Heejun Yang	Sungkyunkwan University
	Peter Littlewood	University of Chicago
Process and Tools for Manufacturing Committee
Chair	Bich-Yen Nguyen	Soitech
Co-Chair	Ming Li	Peking University
Members	Anupam Mitra	Kioxia Corp.
	Keiichi Nakazawa	Sony Semiconductor
	Wenjun Li	GlobalFoundries
	Chin-Lai Chen	Advanced Micro Foundry
	Cuiqin Xu	Huali
	Anne Vandooren	IMEC
	Shawn Thomas	AMAT
	Walter Schwarzenbach	Soitec
	Yoshiki Yamamoto	Renasas
	Michael Givens	ASM
	Jin Kang	SMIC
	Jianjun Zhang	Institute of Physics, CAS
	Seongjae Cho	Gachon University
	Weiping Bai	CXMT
	Huimei Zhou	IBM
	Marie Mochizuki	Lapis Semiconductor
Semiconductor Devices Committee
Chair	Toshiro Hiramoto	University of Tokyo
Co-Chair	Jiezhi Chen	Shandong University
Members	Lieyong Yang	SMIC
	Naoto Horiguchi	IMEC
	Gong Xiao	National University of Singapore
	Yogesh Singh Chauhan	Indian Institute of Technology, Kanpur
	Hyungcheol Shin	Seoul National Univ.
	Yi Yang	Tsinghua University
	Chen Jiang	University of Cambridge
	Christofer Hierold	ETH Zuric
	Roger Booth	Qualcomm
	Ran Cheng	Zhejiang University
	Zhigang Ji	Shanghai Jiao Tong University
	Jing Liu	Institurte of Microelectronics, CAS
	Nanbo Gong	IBM T. J. Watson Research Center
	Kimihiko Kato	AIST
	Yuichiro Mitani	Tokyo City University
	Deyuan Xiao	Guangdong Haixin Integrated Circuit Ltd
Power and Energy Devices Committee
Chair	Shibing Long	USTC
Co-Chair	Kejun Xia	NXP
Co-Chair	Wanjun Chen	UESTC
Members	Moufu Kong	UESTC
	Wai Tung Ng	University of Toronto
	Srabanti Chowdhury	Stanford University
	Uttam Singisetti	SUNY at Buffalo
	David Sheridan	Alpha and Omega Semiconductor
	Can Bayram	UIUC
	Rongming Chu	Penn State University
	Yu Cao	QORVO
	Jae-Hyung Jang	GIST
	Weifeng Sun	SEU, China
	Carol Zhan	On semi, US
	Ray Hueting	University of Twente
	Huiqing Wen	Xi'an Jiaotong-Liverpool University
	Tetsuya Suemitsu	Tohoku University
Modeling and Simulation Committee
Chair	Bin Gao	Tsinghua University
Co-Chair	Paul Zhou	ADI
Members	Dondee Navarro	Hiroshima University
	Darsen Lu	National Cheng Kung University
	Chika Tanaka	Kioxia Corporation
	Paul Lining Zhang	Peking University
	Benjamin Iniguez	Universitat Rovira, Virgili
	Victor Moroz	Synopsys
	Slobodan Mijalkovic	Silvaco
	Elena Gnani	University of Bologna
	RISHO KOH	Renesas
	Mansun Chan	HKUST
	Te-Kuang Chiang	National University of Kaohsiung
	Xingsheng Wang	HUST
	Lang Zeng	Beihang University
	Rongmei Chen	IMEC
	Peng Huang	Peking University
	Przemyslaw Gromala	Robert Bosch GmbH
	D.NIRMAL	Karunya Institute of Technology and sciences
Reliability Committee
Chair	Runsheng Wang	Peking University
Co-Chair	Durgamadhab Misra	New Jersey Institute of Technology
Members	Mahadeva Iyer Natarajan	Allegromicro
	Rakesh Ranjan	Samsung
	Ang Diing Shenp	NTU Singapore
	Byoung Min	Globalfoundries
	Sriram Kalpat	Qualcomm
	Zhong Chen	University of Arkansas
	Yuan Zhang	Amazon 126 Lab
	Tam Lyn Tan	Globalfoundries Singapore
	Jifa Hao	On Semiconductor
	Zakariae Chbili	Intel
	Yuhao Zhang	Virginia Tech
	Osama Awadelkarim	Penn State University
	Chris Changze Liu	Hisilicon
	Xing Wu	East China Normal University
	Xiangwei Jiang	Institute of Semiconductors, CAS
	Ephraim Suhir	University of Portland/University of Vienna
Packaging and Heterogeneous Integration Committee
Chair	Jian Cai	Tsinghua University
Co-chair	Xuejun Fan	Lamar University
Members	Jie Xue	CISCO
	Jin Kim	Google
	Naoki Oka	Applied Materials Japan, Inc
	Sarah Ying Zhong	University of South Florida
	Chih-Hang Tung	TSMC
	Yifan Guo	ASE
	Ke Xiao	NCAP
	Wei Keat Loh	Intel Malaysia
	Xiaowu Zhang	IME Singapore
	Tanja Braun	Fraunhofer IZM
Yield and Manufacturing Committee
Chair	Weihai Bu	STIC
Co-Chair	Bill Nehrer	Applied Materials
Members	Tomasz Brozek	PDF Solutions
	Keizo Hiraga	Sony
	Rebecca Mih	Apple Inc.
	Angelo Pinto	Qualcomm
	Enjing Cai	HLMC
	Fei Wang	Yangtze Memory (YMTC)
	Yibo Lin	Peking University
	Zuochang Ye	Tsinghua University
	Yajuan Su	IME CAS
	Sean Yang	Semitronix
Memories Committee
Chair	Hangbing Lv	IMECAS
Co-Chair	Shimeng Yu	Georgia Institute of Technology
Members	Yantao Ma	Micron Technology
	Jianshi Tang	Tsinghua University
	Qiangfei Xia	University of Massachusetts at Amherst
	Hugh Barnaby	Arizona State University
	Kai Ni	Rochester Institute of Technology
	Wilman Tsai	Stanford University
	Yangying Chen	Western Digital
	Tuo-Hung Huo	National Chiao Tung University
	Weisheng Zhao	Beihang University
	Min Hyuk Park	Pusan National University
	Bing Chen	Zhejiang University
	Elisa Vianello, CEA-Leti	CEA-LETI
	Reika Ichihara	Kioxia
Sensor, MENS, Bio-Electronics Committee
Chair	Xinxin Li	SIMIT CAS
Co-Chair	Evelyn N Wang	MIT
Co-Chair	Jiahao Zhao	Tsinghua University
Members	Chen Yang	ADI
	Zhenhua Tian	Mississippi State University
	Hung Cao	UC Irvine
	Sumant Sood	Apple
	Wei Wang	Peking University
	Hongyu Yu	HKUST
	Dong-Weon Lee	Chonnam National University
	Bikram Bhatia	University of Louisville
	Yangying Zhu	UC Santa Barbara
	Dan Preston	Rice University
	Jingjing Zhao	Stanford University
	Bo Ma	Stanford University
	Jun Chen	UCLA
Photonics, Imaging and Display Committee
Chair	Guozhen Shen	Institute of Semiconductors, CAS
Co-Chair	Mona Jarrahi	University of California, Los Angeles
Members	John Dallesasse	University of Illinois
	Charles Surya	Nazarbayev University
	Gang Li	Hong Kong Polytechnic University
	Kasturi Saha	Indian Institute of Technology, Bombay
	Kai Wang	Sun Yat-Sen University
	Hang Zhou	Peking University
	Shamsul Arafin	Ohio State University
	Zhiyong Fan	Hong Kong University of Science and Technology
	Chuan Wang	Washington University in St Louis,
	Qihua Xiong	Nanyang Technological University,
	Euan Mcleod	University of Arizona
	Shang-Hua Yang	National Tsing Hua University,
	Hong Lu	Nanjing University
Flexible and Wearable Electronics Committee
Chair	Xiaojun Guo	Shanghai Jiao Tong University
Co-Chair	Sheng Xu	University of California, San Diego
Members	In Hee Lee	University of Pittsburg
	Luisa Petti	Free University of Bozen-Bolzano
	Feng Yan	Poly U, HK
	Sean M Garner	Corning
	Jie Zhang	Jiangnan University
	Di Geng	Institute of Microelectronics, CAS
	Sungjune Jung	POSTECH
	Luyao Lu	George Washington
	Wentao XU	Nankai University
	Ting Zhang	SINANO, CAS
	Caofeng Pan	Beijing Institute of Nanoenergy and Nanosystems, CAS
Nanotechnologies Committee
Chair	Xinran Wang	Nanjing University
Co-Chair	Stephen Goodnick	Arizona State University
Members	Yanqing Wu	Peking Univerity
	Yuanyuan Shi	IMEC
	Mario Lanza	King Abdullah University of Science and Technology
	Qing Tu	Texas A&M University
	Gengchiau Liang	National University of Singapore
	Jianbin Xu	Chinese University of Hong Kong
	Deji Akinwande	UT Austin
	Fengqiu (Frank) Wang	Nanjing U
	Jingbi You	Institute of Semiconductors, CAS
	Wolfgang Porod	University of Notre Dame
	Trevor Thornton	Arizona State University
	Yonhua Tseng	National Cheng Kung University,
	Yasushi Okada	University of Tokyo
Disruptive Technologies - IoT, AI/ML, Neuromorphic & Quantum Computing Committee
Chair	Yuchao Yang	Peking University
Co-Chair	Haifeng Yu	Tsinghua University
Co-Chair	Dmitri Strukov	University of California, Santa Barbara
Members	Fabrice Meriaudeau	Universiti de Bourgogne
	Luat Vuong	UC Riverside
	Xizhu Peng	UESTC
	G.P. Li	UC Irvine
	Can Li	HP Labs
	Xiaojian Zhu	Ningbo Institute of Materials Technology and Engineering (NIMTE)
	Bipin Rajendran	King's College London
	Le Ye	Peking University
	Bei Zeng	Hong Kong University of Science and Technology
	Zhangqi Yin	Beijing Institute of Technology
	Heng Fan	Institute of Physics, CAS
	Galan Moody	UCSB
	Gina Adam	George Washington University

Organization Committees
Roles	Names	Affiliations
General Chair	Albert Wang	University of California, Riverside
General Co-Chair	Tianchun Ye	IME-CAS
TPC Chair	Huaqiang Wu	Tsinghua University
TPC Co-Chair	Subramanian Iyer	University of California, Los Angeles
International Advisory Committee
Chair	Tsu-Jae King Liu	University of California, Berkeley
Co-Chair	Bin Zhao	EBI
Members	Cary Yang	Santa Clara University
	Ilesanmi Adesida	Nazarbayev University
	Hiroshi Iwai	Tokyo Institute of Technology
	Kaustav Banerjee	University of California, Santa Barbara
	Shuji Ikeda	Tei-Solutions
	Adelmo Ortiz-Conde	Universidad Simón Bolívar (USB), Venezuela
	Hitoshi Wakabayashi	Tokyo Institute of Technology
	Paul K.L. Yu	University of California, San Diego
	Cor Claeys	KU Leuven
	Jamal Deen	McMaster University
	Chennupati Jagadish	Autralian National University
	Krishna Saraswat	Stanford University
	T. P. Ma	Yale University
	Reza Arghavani	Sandia National Laboratories
Finance Committee
Chair	Bin Zhao	EBI
Co-Chair	Bin Gao	Tsinghua University
Members	Ravi Todi	Western Digital
	Albert Wang	University of California, Riverside
	Tianchun Ye	IME-CAS
	Huaqiang Wu	Tsinghua University
	Xuecheng Zou	Huazhong University of Science and Technology
	He Tang	University of Electronic Science and Technology of China
Publications Committee
Chair	Jianshi Tang	Tsinghua University
Co-Chair	Hitoshi Wakabayashi	Tokyo Institute of Technology
Co-Chair	Yi Li	Huazhong University of Science and Technology
Members	Enrico Sangiorgi	Università di Bologna (JEDS EiC)
	Jesus A del Alamo	MIT (EDL EiC)
	Albert Wang	University of California, Riverside
	Huaqiang Wu	Tsinghua University
Education/Short-Course Committee
Chair	Tianling Ren	Tsinghua University
Co-Chair	Qiming Shao	Hong Kong University of Science & Technology
Co-Chair	Navakanta Bhat	Indian Institute of Science, Bangalore, India
Co-Chair	Yimao Cai	Peking University
Members	Mengyuan Hua	Southern University of Science and Technology
	Jong-Hyun Ahn	Yonsei University
	Jianbin Xu	Chinese University of Hong Kong
	Udayan Ganguly	IIT Bombay
	Shaibal Mukherjee	IIT Indore
Publicity Committee
Chair	Peng Zhou	Fudan University
Co-Chair	Srabanti Chowdhury	Stanford University
Co-Chair	Mario Lanza	King Abdullah University of Science and Technology
Members	David Perez	Guangdong Technion - Israel Institute of Technology (China)
	Matteo Meneghini	U. Padova, Italy
	T. Uesugi	Nagoya University, Japan
	Fei Hui	Israel institute of Technology (Technion) - Israel
	Mireia Bargallo-Gonzalez	Nationcal Center of Microelectronics (CNM)
	Miguel Muñoz-Rojo	University of Twente (Holland)
	Shu-Ting Han	Shenzhen University
	Runwei Li	Ningbo Institute of Materials Technology and Engineering, CAS
	Zengguang Cheng	Fudan University
Sponsorships & Exhibition Committee
Chair	He Qian	Tsinghua University
Co-Chair	Xuecheng Zou	Huazhong University of Science and Technology
Co-Chair	Bill Nehrer	Applied Materials
Co-Chair	Aabid Husain	Atomera, Inc.
Emerging Technologies Committee
Chair	Shuji Ikeda	Tei-Solutions
Co-Chair	John Dallessase	UIUC
Co-Chair	Qi Liu	Fudan University
Co-Chair	He Tang	University of Electronic Science and Technology of China
Co-Chair	Patrick Fay	University of Notre Dame
Conference Planning / Local Arrangement Committee
Chair	He Tang	UESTC
Co-Chair	Wanli Zhang	UESTC
Industrial Advisory Committee
Chair	Meikei Ieong	HSMC
Co-Chair	Anthony Yen	ASML (USA)
Co-Chair	Judy Xilin An	Beijing Institute of Carbon-Based IC
Co-Chair	Masumi Saitoh	Kioxia
Members	Bill Nehrer	Applied Materials
	Vivek Jain	Maxim Integrated
	Bich-Yen Nguyen	Soitech
	Roger Booth	Qualcomm
North American Arrangement Committee
Chair	Jesus A del Alamo	MIT (EDL EiC)
Co-Chair	Murty Polavarapu	BAE Systems
Members	Reza Arghavani	Sandia National Laboratories
	John Dallessase	UIUC
	Usha Varshney	National Science Foundation USA
	Muhammad Alam	Purdue University
	Daniel Camacho	Intel
European Arrangement Committee
Chair	Merlyne de Souza	University of Sheffield, UK
Co-Chair	Benjamin Iniguez	University Rovira i Virgili, Spain
Members	Giovanni Ghione	Politecnico di Torino, Italy (TED EiC)
	Zhirun Hu	University of Manchester
	Mikael Östling	KTH Sweden
	François Andrieu	CEA-LETI
Region 9 Arrangement Committee
Chair	Jacobus Swart	University of Campinas
Co-Chair	Edmundo A. Gutierrez-D	National Institute for Astrophysics, Optics and Electronics (INAOE), Maxico
Members	Gilson I Wirth	UFRGS - Universidade Federal do Rio Grande do Sul
	Ricardo Reis	Universidade Federal do Rio Grande do Sul (UFRGS)
	Marcelo Pavanello	Centro Universitario FEI, Brazil
	Jose Diniz	University of Campinas
	Arturo Escobosa	Cinvestav-IPN
	Joel Molina	INAOE, Mexico

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